Alle Meldungen, Produkte und Entwicklungen rund um Indium Corporation.
138 Meldungen
Indium Corporation's Foo Siang Hooi will address critical performance factors of compressible metal thermal interface materials beyond thermal conductivity at TestConX China in Suzhou on October 29, 2026.
Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…
Micron Technology has announced a strategic investment in Indium Corporation as part of its up to $3 billion U.S. supply-chain programme, targeting the restart of domestic critical minerals processing essential to…
Indium Corporation's Indium12.9HF no-clean, halogen-free solder paste has received a Mexico Technology Award in the solder paste category, recognised for its performance in fine-aperture printing and high-density…
Indium Corporation's Senior Applications Development Engineer Ryan Mayberry will present test data on liquid metal thermal interface materials and liquid-cooled cold plate co-optimisation at the OCP Global Summit,…
Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with…
Indium Corporation will exhibit three solder paste technologies at Expo for Electronics Manufacturing (EFX) 2026 in Stuttgart, Germany, addressing thermal cycling performance, low-temperature step soldering and…
Indium Corporation will exhibit a range of solder and sintering materials at the IMAPS Symposium in Boston on 29–30 September, focusing on advanced packaging, power device die-attach and thermal management for AI-driven…
Indium Corporation will deliver three technical presentations at the IMAPS Symposium in Boston (29 September–1 October), addressing materials challenges in advanced packaging, AI, and high-performance computing…
Indium Corporation's range of low-temperature liquid and fusible alloys serves a broad spectrum of electronics manufacturing processes, from SMT assembly and hot bar soldering to cathodic protection and high-temperature…
Indium Corporation outlines its materials and process solutions for physical vapour deposition (PVD) coating and thermal evaporation within advanced semiconductor packaging workflows.
Indium Corporation has inaugurated a new manufacturing facility in Guadalajara, Mexico, producing solder paste, cored wire, and wave flux to serve customers across the Americas and global markets.
Indium Corporation will present new research on two materials platforms at ICEPT 2026 in Xi'an, China: its Durafuse LT bismuth-free lead-free solder and a pressure copper sintering paste developed for high-power…
Indium Corporation will present research on high-conductivity metal thermal interface materials for next-generation AI and high-performance computing packages at IMAPS ThermCon 2026 in Santa Clara, 6–8 July.
Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development Director, placing a metallurgist best known for co-inventing Durafuse technology and developing the BiAgX alloy family at the helm of the…
Indium Corporation is presenting its range of semiconductor packaging materials at SEMICON Taiwan 2026, focusing on solutions for fine-pitch microbump assembly, thermal management, and advanced packaging in AI and HPC…
Indium Corporation will present its Durafuse technology family, fine-feature solder pastes, and thermal interface materials at Productronica India, held 16–18 September in Bengaluru — underscoring the growing importance…
At the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026 in Guangzhou, Indium Corporation will examine how precisely matching solder materials and assembly processes can…
Indium Corporation will present advanced material solutions targeting the thermal and interconnect challenges of AI semiconductor packaging at SEMICON Taiwan, 2–4 September in Taipei. The presentation covers flux…
Indium Corporation will deploy three application engineers at PCIM Expo 2026 to address solder materials, sintering and thermal interface challenges across power module packaging, e-mobility and AI data centre…
Indium Corporation will exhibit its high-reliability semiconductor packaging materials at ECTC 2026, spotlighting flip-chip fluxes, pressureless and pressure Cu sintering pastes, and a fine-aperture solder paste aimed…
Indium Corporation will exhibit its materials portfolio for AI and power electronics applications at SEMICON SEA 2026 in Kuala Lumpur, 5–7 May, covering flux-free reflow, thermal interface materials, low-temperature…
Indium Corporation will deliver two presentations at SEMICON SEA 2026 in Kuala Lumpur addressing materials challenges in AI and hyperscale semiconductor packaging, including Durafuse LT low-temperature solder,…
Indium Corporation has been awarded a $3.2 million U.S. Department of Energy grant under the TRACE-Ga initiative to develop a domestic process for recovering high-purity gallium from manufacturing by-products,…
Indium Corporation has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a government-backed initiative linking industry, academia and government to build semiconductor manufacturing…
Indium Corporation will present advanced soldering and sintering material solutions for power electronics packaging at CIPA 2026, focusing on wide bandgap semiconductors and high-reliability assembly under extreme…
Indium Corporation will present next-generation semiconductor packaging material solutions at PCIM Asia 2026 in Shenzhen, covering interconnection materials and process innovations aimed at improving yield, reliability…
Indium Corporation will exhibit its high-reliability power device packaging portfolio at PCIM Asia 2026 in Shenzhen, highlighting copper and silver sinter pastes as well as flux-free reflow solutions for next-generation…
The Surface Mount Technology Association has announced its Next Gen 10 award recipients for 2026, honouring ten young professionals from companies including Intel Foundry, Indium Corporation, KYZEN, and actnano.
Indium Corporation is presenting collaborative INEMI research at ICEP-HBS in Hiroshima comparing SnBi and SAC305 solder alloys for first-level interconnects in advanced heterogeneous packages, with results showing…