Indium Corporation will participate in PCIM Asia 2026, held August 26–28 in Shenzhen, China, where Senior Area Technical Manager Leo Hu will deliver a technical presentation titled Next-Gen Advanced Packaging Materials and System Integration for Power Electronics. The session is scheduled for August 26 at 13:30–13:50 CST and will be held at Hall 16, Booth F30.
The presentation examines how advanced interconnection materials and process innovations work in combination to address current challenges in next-generation semiconductor packaging. Key topics include thermocompression and laser-assisted bonding, ultra-low residue fluxes, temporary adhesives, and fine-pitch printing technologies. These process areas are increasingly relevant as the industry moves toward tighter pitch geometries, higher power densities, and more complex heterogeneous integration architectures.
Thermocompression bonding and laser-assisted bonding are gaining traction in advanced packaging as alternatives or complements to conventional reflow processes, particularly where precise thermal and mechanical control is required to maintain interconnect integrity at fine pitches. Ultra-low residue fluxes address cleanliness requirements in sealed or high-reliability assemblies, while temporary adhesives play a role in wafer-level and panel-level processes where substrate handling is critical. Fine-pitch printing technologies directly relate to solder paste deposition challenges as interconnect dimensions continue to shrink.
Leo Hu brings 20 years of experience in semiconductor packaging to the presentation, with a focus on assembly technology development, process improvement, and assembly materials applications. He manages Indium Corporation's regional technical support team for East China, operating from the company's Suzhou facility, and collaborates with the global organisation to deliver application-specific solutions to customers. He holds a master's degree in integrated circuit engineering from the Institute of Computing Technology, Chinese Academy of Sciences.
For European electronics manufacturers and their supply chains sourcing advanced packaging materials, presentations at events such as PCIM Asia provide relevant insight into material developments that are often transferred into global production environments. Indium Corporation's portfolio for power electronics packaging spans solder alloys, fluxes, solder pastes, and bonding materials used across a range of semiconductor assembly processes. Further information is available at indium.com.
Quelle: Indium Corporation – https://www.indium.com/press-releases/powering-the-future-indium-corporation-to-present-next-gen-semiconductor-packaging-solutions-at-pcim-asia/
