Nanoscribe has detailed its range of photoresins engineered for Two-Photon Polymerization (2PP) and Two-Photon Grayscale Lithography (2GL), targeting high-precision micro-optics manufacturing on silicon, glass, and III–V substrates.
Fabmatics has integrated the business activities of SCI under the Fabmatics brand, consolidating the acquired expertise within its semiconductor automation portfolio.
Entegris and Kioxia are deepening their strategic partnership to co-develop materials and process technologies for future BiCS FLASH 3D NAND architectures, using AI, digital-twin modelling and experimental validation at…
Entegris is moving into silicon carbide and diamond-enabled thermal management materials for next-generation AI advanced packaging, completing an acquisition, announcing a Taiwan manufacturing line and signing a…
Technic will exhibit at SEMICON Europa 2026 (10–13 November, Messe München, Booth #B1361), presenting its Elevate® portfolio of electroplating chemistries targeting advanced packaging, IC substrates, power devices,…
Technic Asia Pacific has upgraded its Singapore site with cleanroom-grade analytical laboratories and a high-purity local blending capability, targeting advanced packaging customers across the region.
Indium Corporation's Foo Siang Hooi will address critical performance factors of compressible metal thermal interface materials beyond thermal conductivity at TestConX China in Suzhou on October 29, 2026.
Taiwan and Chinese IP authorities have upheld two Entegris patents covering acidic colloidal silica slurry technology used in chemical mechanical planarization, rejecting invalidation attempts by a Qnity Electronics…
ClassOne Technology's Solstice wet etch chamber is positioned for under-bump metallization (UBM) and patterned metal etch in wafer-level packaging, with integrated end-point detection to minimise undercut and CD loss.
SEMI projects global 300mm front-end fab equipment spending to reach $149 billion in 2026 and climb to $227 billion by 2029, with 20 new fabs or lines beginning construction this year alone.
White Knight Fluid Handling, a Graco company, has introduced the ThermaPoint compact inline heater series engineered for ultrapure, low-flow point-of-use applications in semiconductor manufacturing and life sciences.
ERS electronic has unveiled a fully automated panel-level packaging system for 310×310 mm substrates, consolidating three thermally critical process steps into one platform. The system targets advanced packaging…
The Electronic Specialty Gases & Systems Conference (ESGS) 2026 will convene industry leaders from November 10–12 in Phoenix, Arizona, focusing on the gases and systems critical to advanced semiconductor fabrication.
Indium Corporation will exhibit a range of solder and sintering materials at the IMAPS Symposium in Boston on 29–30 September, focusing on advanced packaging, power device die-attach and thermal management for AI-driven…
Indium Corporation will deliver three technical presentations at the IMAPS Symposium in Boston (29 September–1 October), addressing materials challenges in advanced packaging, AI, and high-performance computing…
KYZEN will feature three MICRONOX cleaning chemistries engineered for high-reliability semiconductor applications at the IMAPS Symposium 2026 in Everett, MA, highlighting solutions for IGBT modules, advanced leadless…
Koh Young Technology will exhibit its True3D measurement-based inspection and metrology systems for semiconductor and advanced packaging at SEMICON West 2026, 13–15 October at the Moscone Center, San Francisco.
SEMI has released a position paper outlining nine policy recommendations for the European Chips Act 2.0, targeting competitiveness, supply chain resilience, and investment conditions across design, materials, equipment,…
Global semiconductor equipment billings rose 23% year-over-year to US$40.53 billion in Q2 2026, marking a second consecutive record quarter, according to SEMI's Worldwide Semiconductor Equipment Market Statistics report.
SEMI and Silicon Catalyst have formalised a global strategic partnership via a Memorandum of Understanding signed at SEMICON Taiwan 2026, aiming to accelerate semiconductor hardware innovation by linking startups with…
Indium Corporation outlines its materials and process solutions for physical vapour deposition (PVD) coating and thermal evaporation within advanced semiconductor packaging workflows.
Indium Corporation will present research on high-conductivity metal thermal interface materials for next-generation AI and high-performance computing packages at IMAPS ThermCon 2026 in Santa Clara, 6–8 July.
SEMI has opened registration for SEMICON Europa 2026, returning to Munich from 10–13 November co-located with electronica, with a programme centred on building a competitive European semiconductor ecosystem.
Diodes Incorporated has finalised its acquisition of ElevATE Semiconductor, a supplier of high-performance integrated circuits for the automated test equipment (ATE) market, combining ElevATE's test-focused expertise…