Plasmatreat's PFW10 and PFW20 static plasma jet systems are designed for selective, high-accuracy surface treatment of sensitive electronic assemblies, including circuit boards, using cold atmospheric-pressure plasma.
Europlacer makes the case that traditional SMT software was not designed for the demands of high-mix, short-run production, and that the resulting performance gap is increasingly visible on the shop floor.
ITW EAE outlines closed-loop process control architecture for wave soldering lines, covering flux deposition, lead-free thermal profiles and top-side hole filling applications.
Cybord identifies three persistent traceability failures in electronics manufacturing — date code mismatches, production lot discrepancies and part number mix-ups — and calls for individual material traceability to…
KIC's David Meza will lead an SMTA Guadalajara webinar focusing on thermocouple attachment methods and their impact on reflow profile accuracy — a critical factor in solder joint quality and process repeatability.
The release of IPC-J-STD-002 Revision F introduces stricter, more precisely defined requirements for solderability testing, including a mandatory automatic flux doctor blade on solderability testers. Equipment lacking…
Indium Corporation will exhibit three solder paste technologies at Expo for Electronics Manufacturing (EFX) 2026 in Stuttgart, Germany, addressing thermal cycling performance, low-temperature step soldering and…
Europlacer has published a technical paper arguing that process variation in solder paste printing represents a disproportionate quality and cost risk in high-mix, low-volume electronics manufacturing, where small batch…
KIC demonstrated its thermal process control portfolio at the SMTA Ciudad Juárez Expo & Tech Forum, highlighting data-driven approaches to reflow soldering optimisation for electronics manufacturers.
KIC and distribution partner E-tronix are hosting a joint webinar focused on automatic thermal profiling techniques for modern SMT manufacturing environments, addressing the growing demand for process control in reflow…
Europlacer outlines a dual-standard approach to Industry 4.0 in SMT assembly, combining the Hermes protocol for machine-to-machine board tracking with IPC CFX for converting production events into actionable business…
Cybord is urging electronics manufacturers and assemblers to extend risk management beyond software defences to the physical component supply chain, citing hardware-based failure modes in ADAS and autonomous vehicle…
Indium Corporation will deploy three application engineers at PCIM Expo 2026 to address solder materials, sintering and thermal interface challenges across power module packaging, e-mobility and AI data centre…
A white paper published by Cybord examines the compliance requirements of the U.S. CHIPS Act and argues that current document-based verification methods leave manufacturers exposed to fraud and misrepresentation risks…
Cybord has published a position paper arguing that automotive OEMs rely on traceability frameworks that have not kept pace with the complexity of modern vehicle electronics. The company advocates moving beyond level 4…
Yamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all
As electronic components become increasingly compact and complex, inspection systems need to do more than just to keep up, they need to stay ahead.
In semiconductor manufacturing, fully automated test systems are employed to ensure efficiency, precision, and cost-effectiveness. Given the high costs
In electronics manufacturing, the quality of the soldering process is critical to the functionality and reliability of the finished assemblies. The solder
As printed circuit board assemblies (PCBAs) become more complex, reliable cleaning is increasingly challenging. Traditional methods often fail to remove
If you want to utilize your manufacturing equipment to the fullest and avoid material overstocks and waste, you need precise real-time data on stock
As electronics become smaller, lighter, and more complex, flexible printed circuits (FPCs) and rigid-flexible printed circuit boards (RFPCBs) have become