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Semiconductor Packaging

Semiconductor Packaging
Semiconductor Packaging

Semiconductors are a key strategic component in any industrial chain.  

Source: Pixabay

The race for the most advanced semiconductors can only be won with technological and industrial leadership. Alongside the traditional mass business, the main drivers are high-tech applications such as Autonomous Driving, Edge Computing, IoT/IIoT, 5G/6G and Artificial Intelligence.

With increased demand, the need for innovative packaging solutions is rapidly growing. The EU has responded and is promoting the expansion of corresponding infrastructures in Europe with the European Chips Act. On this page you will find the latest news and information on all facets of semiconductor packaging.

News

New pathfinding process design kit (PDK) to broaden access to advanced semiconductor technologies

Imec launches first design pathfinding PDK for N2 node

Imec, a research and innovation centre for nanoelectronics and digital technologies, has launched its open process design kit (PDK) with a concomitant training...

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News

10th IEEE Electronics System-Integration Technology Conference

IEEE ESTC 2024 to take place in Berlin, Germany

The 10th IEEE Electronics System-Integration Technology Conference will be held in Berlin from 11–13 September 2024. IEEE ESTC is the premier international event in...

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Semiconductor design and software giant acquires rival software company

Synopsys to acquire Ansys in USD 35 billion deal

US leaders in semiconductor design technology Synopsys and Ansys have announced that they have entered into a definitive agreement under which Synopsys will acquire...

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US semiconductor giant invests further in EU

Intel plans new chip plant in Poland

US manufacturer Intel has announced plans to construct a new semiconductor assembly and test facility near Wrocław in Poland. The company will invest up to USD 4.6...

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ERS electronic

Upgrade on Warpage Adjustment

ERS electronic, a leading supplier in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include...

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Best location for chip manufacturers

Will TSMC be investing in Dresden?

The Taiwanese semiconductor company TSMC is pushing ahead with plans for its own production in Germany. According to information from the business magazine CAPITAL, a...

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Swissbit

New SiP Production Line in Berlin

Swissbit is continuing with its strategic expansion plans at its established production facility in Berlin, Germany by adding a new semiconductor packaging line to its...

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Palomar Technologies

New Managing Director

Palomar Technologies, a global supplier of total process solutions for advanced photonics and microelectronic device packaging, has appointed Mr. Thorsten Scheidler as...

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Fraunhofer

Recovered by Robo Ray

The extremely nimble submersible robot uses a flexible sensor skin to detect lost and unexploded munitions in places that were formerly almost unreachable for all but...

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Leadframe Marking

Leadframe Marking

Intro
A lead frame is the metal structure inside a chip package that carries signals from the die to the outside. It is usually formed from a copper strip. It may be...

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