Miniaturization continues. How does the border shift between SMT and Semiconductor Packaging proceed? What are the solutions for OSATs and SMT manufacturers...
Semiconductor Packaging
Semiconductors are a key strategic component in any industrial chain.
Source: iStock.com/Kynny/Pobytov
The race for the most advanced semiconductors can only be won with technological and industrial leadership. Alongside the traditional mass business, the main drivers are high-tech applications such as Autonomous Driving, Edge Computing, IoT/IIoT, 5G/6G and Artificial Intelligence.
With increased demand, the need for innovative packaging solutions is rapidly growing. The EU has responded and is promoting the expansion of corresponding infrastructures in Europe with the European Chips Act. On this page you will find the latest professionally sound information on all facets of semiconductor packaging.
Packaging holds the key for the further implementation of Moore’s Law. The chances are better than ever that Germany and Europe will play an even more...
Intel announced the first phase of its plans to invest as much as 80 billion euros in the European Union over the next decade along the entire semiconductor...
This week, at Future Summits 2022, imec, a world-leading research and innovation center in nanoelectronics and digital technologies, announces that its...
Worldwide silicon wafer area shipments in the first quarter of 2022 surpassed the previous record high set in the third quarter of 2021, rising 1% quarter-over-quarter...
Direct laser marking in opposite to printing and labeling technologies is well established in SMT when using low power CO2-lasers for color change of solder resist or...
To be able to migrate from precision placement of SMD to Semiconductor packaging a knowledge transfer in several areas of the supply chain is going to take place. We...
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg, Germany, May 10-12, 2022, in Hall 4A, Booth 234: a new precision...
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) and PDF Solutions, Inc. (NASDAQ: PDFS) today announced their existing relationship is expanding to address the...
Koh Young launched a new Meister S model with 3.5 µm pixel resolution and a 25 MP high speed camera.
Koh Young’s product manager Alex Lim introduced the new model...
A Large Automotive Supplier Selects CyberOptics SQ3000 Multi-Function system for 3D Wire Bond Inspection and Metrology. Download the case study for more details on the...
Latest video of Fraunhofer IZM in Berlin showcases their "Wafer Level System Integration" department. A wafer usually consists of silicon or another semiconductor...
Eindhoven, Netherlands - PhotonDelta, a cross-border ecosystem of photonic chip technology organisations, has landed €1.1 billion in public and private investment to...
Worldwide sales of semiconductor manufacturing equipment in 2021 surged 44% to an all-time record of $102.6 billion from $71.2 billion in 2020, SEMI, the industry...
Buhler Leybold Optics, a supplier of cutting-edge thin-film vacuum coaters and imec, a world-leading research and innovation center in nanoelectronics, announce that...
Indium Corporation is announcing the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe
InTACK is a no-clean, no residue...
The Extension Building of AEMtec GmbH, located in Berlin-Adlershof, commenced construction in July 2020 and has now been completed on schedule, despite the challenging...
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore”...
SEMIKRON and Danfoss Silicon Power announced a merger to create a joint business specialized in Power Electronics focusing on power semiconductor modules.
With an...
The new TESLA300 automates high-voltage and high-current IGBT and Power MOSFET device measurements on 300mm wafers to lower test costs and speed...
ERS electronic reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the...
CyberOptics Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will feature the SQ3000...
EKRA Automatisierungssysteme GmbH, a Member of the ASYS Group, is located in the High-Tech Mechanical Engineering Region Stuttgart. EKRA is a development and engineering...
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has introduced a new 3D image viewer, the Euclid, for its Hadatomo series of...
Edwards introduces EJGO, a next-generation vacuum pump controller with cloud connectivity and control for industrial vacuum pumps and systems. EJGO intelligently...
In several Industry sectors we hear more often about a paradigm shift from globalization to regionalization. Some major, global Semiconductor Companies have recently...
The market research and strategy consulting company, Yole Développement (Yole), has a comprehensive understanding of the semiconductor packaging industry. The company...
Semiconductors are in short supply right now and demand is showing no signs of easing off. With this in mind, increasing throughput is just as important as increasing...
The global semiconductor materials market grew 15.9% to $64.3 billion in revenue in 2021, surpassing the previous market high of $55.5 billion set in 2020, Semi, the...
Koh Young Technology Inc., a leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process...
To strengthen cybersecurity for semiconductor manufacturing in Europe, the industry must unify behind security standards, support decision-makers in adopting new...
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their...
Many of our precision stencils are used in manufacturing processes with print deposits smaller than 30µm. This high accuracy with accompanying process reliability...
Heterogeneous integration is the solution for advanced packaging by packing more dies or components into smaller footprints. This entire packaging evolution requires...
Kulicke & Soffa Expands Thermal Compression Bonding Capabilities to Accelerate Innovation in the Integration of Semiconductor and Silicon Photonics Receives...
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution...