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Processing of LEDs in electronics manufacturing

LED meets SMT 2023
LED meets SMT 2023

Unique know-how
Top-class speakers
Experts & Specialists

An event organized by industry insiders for an individual knowledge edge.

25th October 2023

 

Filderhalle Leinfelden

Once again in 2023, our LED meets SMT Forum will focus on the Processing of LEDs in Electronics Manufacturing.
A day of Innovative Presentations by Expert Partners within the Electronics Industry focusing on the Processing of LEDs in Electronics Manufacturing. The Technical Forum will be complemented by a Table-Top Exhibition featuring ample time for networking and discussion.
    Focus Topics:
  • Advanced LED Assembly and Soldering from Standard LED Packages to High Power
  • Pixelated Light Sources
  • NEW: Event language in German with streaming in English language
Data & FactsProgramContactDirectionsImagesVideos
Wednesday, 25 October 2023
Leading Companies
Exhibition of the Partners

Live Presentations by Experts for Experts
Networking
Leading & Independent Event


SMT Manufacturing Processes allow LEDs to be efficiently mounted on PCBs and connected to other Electronic Components. This enables a compact Design, optimal use of Space and fast and precise Assembly when compared to conventional Assembly Methods.

But what challenges can arise in the SMT Assembly of LEDs and how are they overcome?

For example, reliable Connection Technology is of great importance in the production of LEDs in order to establish a stable Electrical Connection and ensure the Service Life of the LEDs. The choice of the appropriate Connection Technology depends on various factors, such as the specific requirements of the Application, the properties of the LEDs and the Production Requirements.

Careful Process Control and Quality Inspection are crucial to ensure a reliable Connection and high Product Quality. Achieving Zero Failure Quality Levels in LED manufacturing is a challenging goal. It requires a combination of different factors and measures to keep the quality of Manufactured LEDs at the highest level.

In addition, Thermal Management plays a crucial role in LED Manufacturing, as LEDs generate heat during operation that must be efficiently dissipated to ensure optimal Performance, Lifetime and Reliability.
LED Manufacturing is central to meeting the increasing demand for efficient Lighting and versatile Applications. It helps to promote Sustainability, Energy Saving and Technological Advancement in numerous areas. In addition, the LED industry creates Jobs and promotes Economic Development.

Target Group:
The core Target Group of this Event will be all Companies that Process LEDs in their Electronics Manufacturing in EMEA and DACH. Functions: Management, Technical Management, (Head of) Production/Manufacturing, Quality Assurance, Design for Manufacturing, Planning/Work Preparation, Purchasing. Industries: EMS or OEM, especially Industrial, Medical, Defence, Automotive, Consumer Electronics. Young professionals, Students and Trainees.

09:00 – 09:10 a.m.
Greeting

Doris Jetter | | Editor-in-Chief | EPP Industrie


9:10 – 10:10 a.m.
Keynote: LED meets SMT – from Small to Extra-Large

Kurt-Jürgen Lang | | Senior Key Expert Processing | ams OSRAM Group


10:10 – 10:40 a.m.
LED Soldering – Low Voiding & Low Temperature

New LED (Matrix) Systems in modern Applications require lower Soldering Temperatures, e.g. to minimize Warping. This also reduces the CO2 Footprint of the Application. A Drop-Shock resistant Connection, with reduced Voids, ensures better Heat Dissipation.
Siegfried Lorenz | | Application Engineer | Indium Corporation
More Information


10:40 – 11:10 a.m.
Break

11:10 – 11:40 a.m.
Thermal Measurement Methods – which ones are applicable?

Based upon examples of Applications within the field of Lighting Technology / LED, the advantages and disadvantages of different Methods for Modelling and Testing Thermal Materials are presented in order to better evaluate a comparison of values from the data sheets of different manufacturers.
Robert Art | | Director of Technical Sales Europe | Ventec Central Europe GmbH
More Information


11:40 – 12:10 p.m.
Assembly of LED/Lidars with the highest Precision

Michael Schimpf | | Technology Scout & Product Manager | ASMPT GmbH & Co. KG
More Information


12:10 – 1:50 p.m.
Lunch Break

1:50 – 2:20 p.m.
Printing Technology for Heat Dissipation from LEDs

Stencil Printing is cost-effective, scalable, and adaptable, making it eminently suitable for Heat Dissipation in a wide range of LED Applications. Priority is given to the Soldering of the LED to the Heat Sink in the SMD Process, followed by Thermal Paste Printing and Sintering.
Harald Grumm | | Head of Dept. FIT & Project Manager Stencil Printing | Ersa GmbH
More Information


14:20 – 14:50 Uhr
Clear view for bright times: Challanges of LED cleaning in the light of technology

Whether building pixelated lightsources, or high-power LEDs, the most successful manufacturers will overcome many hurdles to produce the brightest and most reliable devices, including those surrounding the cleaning process. From material issues such as compatibility with advanced phosphor coatings, to production challenges like short bath life, having the right cleaning solutions can make a significant difference! In this talk, we discuss KYZENs balanced approach to the unique issues faced in LED manufacturing and highlight our goals to make the future of LED cleaning brighter.
Ram Wissel | Applications Engineer | KYZEN Corporation


2:50 – 3:20 p.m.
Break

3:20 – 3:50 p.m.
From mini-LED to SMT – 3D high-speed Reconstruction of Chip Components

Since entering the SMT World, we have noticed that Components are getting a little smaller every year. Even if we don’t particularly require this ourselves. The reasons lie with the Component Manufacturers and their main Customers within Consumer Electronics. For example, the Components have to fit into ever smaller Devices and become cheaper. The result is a shift in the range of Components and smaller Productions also have to face the processing of these smaller Components. This Presentation draws an arc from mini-LEDs to the current sizes and illuminates the limits of 3D Measurement within the SMT World.
Michael Zahn | Sales Manager | Koh Young Europe GmbH
More Information


3:50 – 4:20 p.m.
LED Reliability and typical Failure Modes

Markus Ritzer | | Quality Management | ams OSRAM Group


4:20 p.m.
Closing
Doris Jetter

Editor in Chief EPP and EPP Europe
+49 7021-53609
doris.jetter@konradin.de

Andreas Hugel

Sales
+49 711 7594-472
andreas.hugel@konradin.de

Julia Knapp

Sales
+49 711 7594-327
julia.knapp@konradin.de

Eva Depner

Projektmanagement
+49 711 7594-356
eva.depner@konradin.de

Jasmina Tulic

Projektmanagement
+49 711 7594-591
jasmina.tulic@konradin.de

Event location:
Filderhalle Leinfelden-Echterdingen
Bahnhofstr. 61
70771 Leinfelden-Echterdingen

Directions Filderhalle

Parking:
Underground car park of the Filderhalle
Parking in the underground car park is free of charge for participants.

S-Bahn:
S2, S3 stop Leinfelden (4 min. walk)

U-Bahn:
U5 stop Leinfelden (4 min. walk)

Open route planner Places to stay in the vicinity

Partner 2023


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