Koh Young Technology will present on its Multimodal Phase Shift Optics Approach to high-speed 3D reconstruction of semiconductor and advanced packages at the SMTA Wafer-Level Packaging Symposium in Burlingame, CA on 13 February 2024.During the event, Dr. Seung Hyun Lee, Ph.D. will present...
Events & Tutorials
The global conference and exhibition for the electronics industry, IPC Apex Expo, taking place on 6–11 April 2024, in Anaheim, California, USA will feature...
Global supplier of automated dispensing and coating equipment PVA has opened a new Applications Lab in Guadalajara, Mexico. To commemorate this milestone, the...
Messe München‘s electronics network with its trade fairs electronica and productronica is expanding its partnership with global semiconductor industry...
The winners of the Productronica innovation award 2023 have been chosen just in time for the start of the world’s leading trade fair for electronics...
Koh Young, provider of 3D measurement-based inspection solutions, will offer live demonstrations of its inspection and measurement solutions for printed...
From November 14 to 17, more than 1,300 exhibitors from 45 countries will present their latest solutions and products. An extensive supporting program will...
VJ Electronix Inc., a provider of rework technologies and advanced x-ray inspection and component counting systems will showcase two systems, the Summit 2200i...
SurfX Technologies will be focusing on its revolutionary flux-free flip chip and hybrid wafer bonding technologies at this year’s Productronica event...
At Productronica 2023, coating materials developer Peters will highlight the benefits of its ELPEPCB HSP 801 heatsink paste featuring increased thermal...