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Ahead with Koh Young's process optimizer

AI-based process controls for Industry 4.0

With unwavering dedication to accuracy, quality, and efficiency, Koh Young is driving a new era of production in which inspection and process control seamlessly merge to...

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Efficient deployment of personnel in SMT production

Smart software for smart factories

As performance, quality and cost burdens rise, the shortage of skilled labour is putting the electronics manufacturing sector under even more pressure. To deploy people...

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PCB & Assembly

Thermal management using insulated metal substrates

Applying IMSs in lighting and power conversion

The first article in this two-part series described the composition, principles, and thermal properties of insulated metal substrates (IMSs). This article...

The 5S lean manufacturing methodology in PCB production

Improve benchtop cleaning, reduce waste with 5S

Developed in Japan, 5S is a workplace organisation method used in physical manufacturing to eliminate waste. Elizabeth Norwood, Senior Chemist at cleaning...

Experiment & analysis in QFN assemblies

Minimizing voiding in SMT assembly of BTCs

Voiding in BTCs and, more specifically, QFNs, is arguably the most critical issue in electronic assembly today. In response to this concern, Indium Corporation...

Interview with Guenter Lauber, ASMPT, on carbon neutrality

The road to sustainability

ASMPT, a global leader in hardware and software solutions for the semiconductor and electronics manufacturing industries, recently unveiled its strategy for...

Moving beyond manual ID methods

Laser labelling in electronics manufacturing

With many customers concerned that manual product labelling, used to identify and monitor parts, is unable to meet the stringent demands of modern electronics...

Enabling 3D-placement of electronic components

Harting develops 3D-circuits component carrier

Provider of connectivity solutions in industrial technologies, Harting, has developed the 3D-MID Component Carrier, a manufacturing technology in which...

Test & Quality Assurance

AI-based assistance in automatic inspection systems

The evolution of AI from assistant to decision-maker

Artificial intelligence (AI) can increase production efficiency, save time and money, elevate quality and improve the robustness of industrial processes. But...

Solid-state modules for test applications

Minimizing leakage current with T-circuit MOSFETs

There have long been concerns about the performance of solid-state relays – particularly with regard to leakage current – when used in test applications...

Case study: streamlining test and inspection equipment

The advantages of one inspection vendor

Matthias Müller, Public Relations Manager at German provider of automated inspection solutions Göpel Electronic details how his company’s systems helped...

PCB analysis: Rebuilding the netlist

Seica: Reverse Engineering made easy

In the electronics industry, Reverse Engineering (RE) refers to the process used to understand how a device, object, or system has been designed. It allows for...

AI-based smart factory automation solution

Mirtec: The future of AOI

Mirtec, a leader in inspection technology, has announced the release of a comprehensive AI-based smart factory automation solution called ‘Intelli-Pro’...

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Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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