Miniaturization continues. How does the border shift between SMT and Semiconductor Packaging proceed? What are the solutions for OSATs and SMT manufacturers (OEM, EMS)? A top-class panel discussion with Dr. Tanja Braun, Fraunhofer IZM, Harald Eppinger, KohYoung Europe, Torsten Vegelahn, ASYS Group, and Michael Zahn, KOENEN, provides answers. More in the video.