Homepage » Semiconductor Packaging »

Strong momentum pushed by the giants

Yole
Strong momentum pushed by the giants

Advanced Packaging Revenue Forecast
Advanced Packaging Revenue Forecast Source: Yole

The top 8 advanced packaging players dominate the market and continue with heavy investment.

• The advanced packaging industry is expected to have a 9.6% CAGR (Compound Annual Growth Rate) between 2021 and 2027 to $65 billion.
• The advanced packaging segment as compared with traditional packaging market continues to increase, with more than 50% of the market by 2027.
• The highest advanced packaging market share belongs to the Flip-Chip platform, with 70% of the market in 2021. The highest CAGR is expected from ED , 2.5D/3D, and fan-out at 24%, 14%, and 11%, respectively.

Six players, including 2 IDMs (Intel and Samsung), a foundry (TSMC), and the top 3 global OSATs (ASE, Amkor, JCET), process over 80% of advanced packaging wafers. OSATs accounted for 65% of the advanced packaging wafers in 2021. Foundries are taking advanced packaging business from OSATs with 14% and IDMs with 21%.

IC substrate and PCB manufacturers, including SEMCO, Unimicron, AT&S, and Shinko, are entering the advanced packaging arena. They offer panel-level fan-out packages and embedded dies (and passives) in organic substrates in response to the accelerated adoption of fan-out packaging. These players are taking advantage of their substrate manufacturing know-how, panel line and equipment availability, and thin RDL technology development.

On the other hand, OSATs are expanding their testing expertise, while traditional pure test players are investing in packaging & assembly capabilities. Top OSATs are investing in IC testing capacity to capture the test market, and pure test houses, such as KYEC and Sigurd Microelectronics, are adding packaging/assembly capabilities in their service offering through M&As or investing in R&D.

Overall, there is a paradigm shift in the packaging / assembly business, traditionally the domain of OSATs & IDMs. Players from different business models, foundries, substrate/PCB suppliers, and EMS/ODMs are entering packaging & assembly, cannibalizing the OSAT business.

Substrates have been in tight supply due to strong demand for high-end CPUs, GPUs, and 5G networking chips by major chipmakers. The COVID-19 pandemic, high inflation, and geopolitical tensions are continuing to negatively impact material supplies. The delivery lead time of ABF substrates has been extended to nearly three quarters from 4-5 months due to demand growth outpacing capacity expansion, and prices have risen from 15% to 25%.


Industrie.de Infoservice
Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:














Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.
AGB
datenschutz-online@konradin.de