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Semicon Europa to highlight advanced packaging, fab-management as sustainability aids

Sustainability in microelectronics
Semicon Europa to highlight advanced packaging, fab-management as sustainability aids

Semicon Europa to highlight advanced packaging, fab-management as sustainability aids

Organisers of this year’s SEMICON Europa expo, co-located with productronica in Munich on 14–17 November, have announced that this year’s programme will include the Advanced Packaging Conference and a forum on fab management.
Experts will gather for insights into the latest advanced packaging and fab management trends and innovations as critical enablers of the path to net zero.
Sustainability is vital to the semiconductor industry growth on its path to USD 1 trillion, with electrification, renewable energy, connectivity, and AI playing crucial roles. Collaboration and innovation across the semiconductor supply chain will be essential to fueling sustainability.

This year’s Advanced Packaging Conference (APC) will focus on:

  • Megatrends and Opportunities for Advanced Packaging and Front-End Integration
  • Smarter Supply Chain Solutions for a Sustainable Ecosystem
  • Testing and Reliability
  • System in Package (SiP) Requirements for Future Applications
  • Power Electronics Packaging

Speakers include experts from AT&S, Atotech an MKS Brand, Cohu, Comet Yxlon, Elmos Semiconductor, Evatec, Fraunhofer Institutes, GlobalFoundries, Henkel, imec, Infineon Technologies, JCET Group, Koh Young Europe, Merck, ProSys, STMicroelectronics, and TSMC.
The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, Merck, Panasonic Connect and Resonac Europe.

Fab management forum

  • Fab Expansion Landscape: Opportunities and Challenges
  • Industrial Collaboration Models
  • Poster Session: Industry Meets Innovative Ideas
  • Cultivating the Workforce of Tomorrow
  • Solutions Enabling the Path to Net Zero
  • Smarter Manufacturing for a Connected Ecosystem

Speakers include experts from Applied Materials, D-SIMLAB Technologies, INFICON, Infineon Technologies, Intel, Qualcomm, Robert Bosch, Schneider Electric, STMicroelectronics, Texas Instruments, Tokyo Electron Europe, Watlow, Wolfspeed, and X-FAB.
The forum is sponsored by Comet Yxlon, Edwards, Flexciton, INFICON, Sachsen-Anhalt, Schneider Electric, Tokyo Electron Europe (TEL), and Watlow.
Visit Semicon Europa for more information.

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2023
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