https://epp-europe-news.com EPP Europe – news and practice on SMT assembly, soldering, inspection & test, dispensing, cleaning and smart factory for electronics manufacturing. de-DE Fri, 13 Nov 2026 07:01:30 GMT 60 https://epp-europe-news.com/artikel/microtronic-extends-lbt210-solderability-tester-with-centralised-database-option-94623f https://epp-europe-news.com/artikel/microtronic-extends-lbt210-solderability-tester-with-centralised-database-option-94623f Microtronic has introduced a centralised database extension for its LBT210 solderability tester, enabling multi-site manufacturers to synchronise test settings, flux and solder data, user rights and results across all connected instruments from a single location. Fri, 13 Nov 2026 07:01:30 GMT Productronica https://epp-europe-news.com/artikel/microtronic-introduces-automated-dip-look-tester-for-solderability-testing-cc3c46 https://epp-europe-news.com/artikel/microtronic-introduces-automated-dip-look-tester-for-solderability-testing-cc3c46 Microtronic GmbH has launched the D&L Automator, an automated, PC-controlled system for Dip and Look solderability testing, addressing evolving IPC requirements for demonstrating active wetting. Thu, 12 Nov 2026 12:01:31 GMT Product-news https://epp-europe-news.com/artikel/microtronic-appoints-baimac-solutions-as-north-american-distributor-for-solderability-test-73e896 https://epp-europe-news.com/artikel/microtronic-appoints-baimac-solutions-as-north-american-distributor-for-solderability-test-73e896 Microtronic M.V. GmbH has named Baimac Solutions LLC as its official distribution partner for the LBT210 solderability tester and D&L Automator in North America, expanding local sales and service capacity for the German test equipment specialist. Thu, 12 Nov 2026 07:01:25 GMT Company-news https://epp-europe-news.com/artikel/microtronic-m-v-gmbh-expands-acoustic-microscopy-analysis-capacity-with-sonix-systems-1ee626 https://epp-europe-news.com/artikel/microtronic-m-v-gmbh-expands-acoustic-microscopy-analysis-capacity-with-sonix-systems-1ee626 Microtronic M. V. GmbH in Neumarkt-Sankt Veit has significantly expanded its scanning acoustic microscopy capacity using Sonix ultrasound microscopes, enabling analysis results to be delivered to customers within days. Wed, 11 Nov 2026 12:01:30 GMT Company-news https://epp-europe-news.com/artikel/nanoscribe-expands-photoresin-portfolio-for-micro-optics-fabrication-via-two-photon-polyme-e732ed https://epp-europe-news.com/artikel/nanoscribe-expands-photoresin-portfolio-for-micro-optics-fabrication-via-two-photon-polyme-e732ed Nanoscribe has detailed its range of photoresins engineered for Two-Photon Polymerization (2PP) and Two-Photon Grayscale Lithography (2GL), targeting high-precision micro-optics manufacturing on silicon, glass, and III–V substrates. Wed, 11 Nov 2026 07:02:08 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/ipc-j-std-002f-mandates-automatic-flux-doctor-blade-for-solderability-testing-625c8f https://epp-europe-news.com/artikel/ipc-j-std-002f-mandates-automatic-flux-doctor-blade-for-solderability-testing-625c8f The release of IPC-J-STD-002 Revision F introduces stricter, more precisely defined requirements for solderability testing, including a mandatory automatic flux doctor blade on solderability testers. Equipment lacking this feature no longer qualifies for norm-compliant testing. Tue, 10 Nov 2026 12:01:43 GMT Technology https://epp-europe-news.com/artikel/canon-launches-fpa-6400es6a-krf-lithography-system-with-400-wafers-per-hour-throughput-a76dd0 https://epp-europe-news.com/artikel/canon-launches-fpa-6400es6a-krf-lithography-system-with-400-wafers-per-hour-throughput-a76dd0 Canon has announced the FPA-6400ES6a KrF scanner for semiconductor lithography, combining a throughput of 400 wafers per hour with industry-leading overlay accuracy of 4.0 nm and the ability to handle wafer warpage of up to 700 µm — capabilities aimed directly at the growing demands of 3D device integration and AI-driven chip production. Tue, 10 Nov 2026 07:01:34 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/microtronic-partners-with-innotronics-for-lbt-210-distribution-in-india-1a1db9 https://epp-europe-news.com/artikel/microtronic-partners-with-innotronics-for-lbt-210-distribution-in-india-1a1db9 Microtronic M. V. GmbH has appointed Innotronics Technologies Pvt. Ltd. as its distribution, service and training partner for the LBT-210 solderability tester across India. Mon, 09 Nov 2026 12:00:53 GMT Company-news https://epp-europe-news.com/artikel/microtronic-takes-on-distribution-of-iraptor-eye-thermal-profiler-in-germany-5b3a2a https://epp-europe-news.com/artikel/microtronic-takes-on-distribution-of-iraptor-eye-thermal-profiler-in-germany-5b3a2a German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by integrating vibration and thermal imaging data, targeting reflow, wave and selective soldering process optimisation. Mon, 09 Nov 2026 07:01:32 GMT News https://epp-europe-news.com/artikel/boundary-scan-how-ieee-1149-1-enables-structural-board-test-without-physical-probe-access https://epp-europe-news.com/artikel/boundary-scan-how-ieee-1149-1-enables-structural-board-test-without-physical-probe-access As component densities rise and physical test access on PCBs shrinks, boundary-scan testing based on IEEE Std. 1149.1 has become an indispensable structural test method in electronics manufacturing. This article explains the underlying architecture, the test instruction set, and the practical considerations for integrating boundary-scan into a modern production test strategy. Sun, 08 Nov 2026 12:00:56 GMT Boundary-scan https://epp-europe-news.com/artikel/stencil-printing-in-smt-assembly-fundamentals-parameters-and-process-control https://epp-europe-news.com/artikel/stencil-printing-in-smt-assembly-fundamentals-parameters-and-process-control Stencil printing is the most critical single process step in SMT assembly, responsible for the majority of all solder defects. A thorough understanding of its physical principles, key parameters and inspection strategies is essential for achieving consistent, high-yield production. Sun, 08 Nov 2026 07:01:01 GMT Interviews-smt-2017 https://epp-europe-news.com/artikel/selective-soldering-process-fundamentals-equipment-concepts-and-quality-criteria https://epp-europe-news.com/artikel/selective-soldering-process-fundamentals-equipment-concepts-and-quality-criteria Selective soldering has established itself as the method of choice for mixed-technology assemblies where through-hole components must be soldered after SMT reflow without exposing the entire board to a wave solder bath. Understanding the process fundamentals, equipment variants and critical quality parameters is essential for achieving reliable, repeatable results. Sat, 07 Nov 2026 12:01:02 GMT Innovationsforum-hungary-speeches https://epp-europe-news.com/artikel/stencil-printing-in-smt-assembly-fundamentals-process-parameters-and-quality-factors https://epp-europe-news.com/artikel/stencil-printing-in-smt-assembly-fundamentals-process-parameters-and-quality-factors Stencil printing is the first and most critical process step in surface mount technology, responsible for depositing precise volumes of solder paste onto PCB pads. Understanding the underlying mechanics, material interactions and key process variables is essential for achieving consistently high first-pass yields. Sat, 07 Nov 2026 07:00:59 GMT Productronica-videos https://epp-europe-news.com/artikel/fabmatics-absorbs-sci-business-activities-under-unified-brand-0e8a46 https://epp-europe-news.com/artikel/fabmatics-absorbs-sci-business-activities-under-unified-brand-0e8a46 Fabmatics has integrated the business activities of SCI under the Fabmatics brand, consolidating the acquired expertise within its semiconductor automation portfolio. Fri, 06 Nov 2026 12:02:44 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/entegris-and-kioxia-expand-partnership-on-materials-innovation-for-next-gen-3d-flash-memor-8e4ee5 https://epp-europe-news.com/artikel/entegris-and-kioxia-expand-partnership-on-materials-innovation-for-next-gen-3d-flash-memor-8e4ee5 Entegris and Kioxia are deepening their strategic partnership to co-develop materials and process technologies for future BiCS FLASH 3D NAND architectures, using AI, digital-twin modelling and experimental validation at a dedicated centre in Mie Prefecture, Japan. Fri, 06 Nov 2026 07:01:13 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/mass-transfer-printing-and-precision-automation-enabling-microled-and-advanced-component-a-4bf27c https://epp-europe-news.com/artikel/mass-transfer-printing-and-precision-automation-enabling-microled-and-advanced-component-a-4bf27c Placing 25 million LEDs in a single 4K MicroLED display with standard pick-and-place equipment would take over 200 hours. Aerotech explains how mass transfer printing, combined with precision motion systems, addresses the throughput and surface-force challenges inherent at micro-scale. Thu, 05 Nov 2026 12:01:31 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/technic-showcases-circudep-black-knight-colloidal-graphite-metallization-system-for-advanc-8c2c8e https://epp-europe-news.com/artikel/technic-showcases-circudep-black-knight-colloidal-graphite-metallization-system-for-advanc-8c2c8e Technic has released a video highlighting a recent full-service installation of its Circudep Black Knight colloidal graphite metallization system, demonstrating integrated chemistry and equipment delivery for PCB manufacturers. Thu, 05 Nov 2026 07:01:35 GMT Pcb https://epp-europe-news.com/artikel/delvitech-to-showcase-full-horus-aoi-family-at-electronica-2026-27a13b https://epp-europe-news.com/artikel/delvitech-to-showcase-full-horus-aoi-family-at-electronica-2026-27a13b Swiss AOI specialist Delvitech will present its complete AI-native HORUS inspection platform at electronica 2026, running all three system variants live on the stand. Wed, 04 Nov 2026 12:01:09 GMT Trade-shows-events https://epp-europe-news.com/artikel/entegris-enters-sic-and-diamond-thermal-management-market-for-ai-advanced-packaging-663a5c https://epp-europe-news.com/artikel/entegris-enters-sic-and-diamond-thermal-management-market-for-ai-advanced-packaging-663a5c Entegris is moving into silicon carbide and diamond-enabled thermal management materials for next-generation AI advanced packaging, completing an acquisition, announcing a Taiwan manufacturing line and signing a long-term development deal with Element Six. Wed, 04 Nov 2026 07:01:10 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/technic-to-present-elevate-cu-electroplating-processes-at-semicon-europa-2026-01fcc5 https://epp-europe-news.com/artikel/technic-to-present-elevate-cu-electroplating-processes-at-semicon-europa-2026-01fcc5 Technic will exhibit at SEMICON Europa 2026 (10–13 November, Messe München, Booth #B1361), presenting its Elevate® portfolio of electroplating chemistries targeting advanced packaging, IC substrates, power devices, MEMS, and wafer-level applications. Tue, 03 Nov 2026 12:01:04 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/technic-asia-pacific-expands-singapore-facility-with-advanced-analytical-and-production-ca-8a2101 https://epp-europe-news.com/artikel/technic-asia-pacific-expands-singapore-facility-with-advanced-analytical-and-production-ca-8a2101 Technic Asia Pacific has upgraded its Singapore site with cleanroom-grade analytical laboratories and a high-purity local blending capability, targeting advanced packaging customers across the region. Tue, 03 Nov 2026 07:01:00 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/besi-reports-strong-q3-2026-growth-driven-by-hybrid-bonding-and-ai-compute-demand-58a01a https://epp-europe-news.com/artikel/besi-reports-strong-q3-2026-growth-driven-by-hybrid-bonding-and-ai-compute-demand-58a01a BE Semiconductor Industries N.V. (Besi) has announced Q3-2026 results showing sharp year-on-year gains across revenue, net income and orders, with hybrid bonding emerging as a primary growth driver alongside datacenter and AI-related applications. Mon, 02 Nov 2026 12:01:31 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/besi-reports-strong-q2-26-growth-driven-by-hybrid-bonding-and-ai-datacenter-demand-afaafc https://epp-europe-news.com/artikel/besi-reports-strong-q2-26-growth-driven-by-hybrid-bonding-and-ai-datacenter-demand-afaafc BE Semiconductor Industries N.V. (Besi) has reported second-quarter 2026 revenue of €249.9 million and net income of €89.0 million, reflecting year-on-year increases of 68.7% and 177.3% respectively, with hybrid bonding and AI-related datacenter applications cited as primary growth drivers. Mon, 02 Nov 2026 07:02:50 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/besi-launches-datacon-8800-fc-quantum-advx-flip-chip-bonder-with-4-m-accuracy-at-10-000-up-a7498f https://epp-europe-news.com/artikel/besi-launches-datacon-8800-fc-quantum-advx-flip-chip-bonder-with-4-m-accuracy-at-10-000-up-a7498f Besi has introduced the Datacon 8800 FC QUANTUM advX, a high-speed flip chip die bonder claiming 10,000 units per hour throughput and 4 µm placement accuracy, designed for mass reflow C2S production environments handling die sizes from 0.3 to 40 mm. Fri, 30 Oct 2026 12:02:05 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/technic-introduces-high-speed-flow-cell-for-reel-to-reel-and-lead-frame-plating-simulation-62c075 https://epp-europe-news.com/artikel/technic-introduces-high-speed-flow-cell-for-reel-to-reel-and-lead-frame-plating-simulation-62c075 Technic has developed a High Speed Plating Test Cell designed to simulate reel-to-reel and lead frame plating in a laboratory or portable format, supporting process engineers in developing and validating electroplating chemistries ahead of full production deployment. Fri, 30 Oct 2026 07:01:18 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/indium-corporation-to-present-on-compressible-metal-tims-at-testconx-china-25cb8d https://epp-europe-news.com/artikel/indium-corporation-to-present-on-compressible-metal-tims-at-testconx-china-25cb8d Indium Corporation's Foo Siang Hooi will address critical performance factors of compressible metal thermal interface materials beyond thermal conductivity at TestConX China in Suzhou on October 29, 2026. Thu, 29 Oct 2026 12:02:08 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/indium-corporation-presents-solder-materials-research-at-smtai-2026-a6e5f1 https://epp-europe-news.com/artikel/indium-corporation-presents-solder-materials-research-at-smtai-2026-a6e5f1 Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste deposition quality. Thu, 29 Oct 2026 07:01:03 GMT News https://epp-europe-news.com/artikel/plasmatreat-pfw10-and-pfw20-static-plasma-jets-target-sensitive-pcb-surface-treatment-051f1d https://epp-europe-news.com/artikel/plasmatreat-pfw10-and-pfw20-static-plasma-jets-target-sensitive-pcb-surface-treatment-051f1d Plasmatreat's PFW10 and PFW20 static plasma jet systems are designed for selective, high-accuracy surface treatment of sensitive electronic assemblies, including circuit boards, using cold atmospheric-pressure plasma. Wed, 28 Oct 2026 12:01:48 GMT Technology https://epp-europe-news.com/artikel/rena-targets-photonic-integrated-circuit-fabs-with-tailored-wet-processing-equipment-f756fb https://epp-europe-news.com/artikel/rena-targets-photonic-integrated-circuit-fabs-with-tailored-wet-processing-equipment-f756fb RENA Technologies addresses the growing demand for precision wet processing in photonic integrated circuit fabrication, offering equipment and chemical solutions designed around the specific requirements of photonics fabs scaling production of silicon photonics and related platforms. Wed, 28 Oct 2026 07:01:54 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/entegris-wins-cmp-slurry-patent-disputes-in-taiwan-and-china-7ca0dc https://epp-europe-news.com/artikel/entegris-wins-cmp-slurry-patent-disputes-in-taiwan-and-china-7ca0dc Taiwan and Chinese IP authorities have upheld two Entegris patents covering acidic colloidal silica slurry technology used in chemical mechanical planarization, rejecting invalidation attempts by a Qnity Electronics affiliate. Tue, 27 Oct 2026 12:01:28 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/classone-technology-targets-ubm-wet-etch-with-solstice-platform-dada9a https://epp-europe-news.com/artikel/classone-technology-targets-ubm-wet-etch-with-solstice-platform-dada9a ClassOne Technology's Solstice wet etch chamber is positioned for under-bump metallization (UBM) and patterned metal etch in wafer-level packaging, with integrated end-point detection to minimise undercut and CD loss. Tue, 27 Oct 2026 07:00:58 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/automated-optical-inspection-in-smt-principles-system-architecture-and-process-integration https://epp-europe-news.com/artikel/automated-optical-inspection-in-smt-principles-system-architecture-and-process-integration Automated Optical Inspection has become an indispensable quality gate in surface-mount assembly lines. Understanding its underlying measurement principles, system variants and integration strategies is essential for engineers seeking robust, zero-defect production. Mon, 26 Oct 2026 12:31:52 GMT Smtconnect-2022 https://epp-europe-news.com/artikel/automated-optical-inspection-principles-configuration-and-integration-in-modern-smt-lines https://epp-europe-news.com/artikel/automated-optical-inspection-principles-configuration-and-integration-in-modern-smt-lines Automated Optical Inspection has become an indispensable quality gate in surface-mount assembly. Understanding its underlying imaging principles, algorithmic approaches and strategic placement within the production line is essential for maximising defect detection rates while minimising false calls. Mon, 26 Oct 2026 12:30:57 GMT Smtconnect-2020 https://epp-europe-news.com/artikel/reflow-soldering-process-principles-profile-design-and-common-defect-mechanisms https://epp-europe-news.com/artikel/reflow-soldering-process-principles-profile-design-and-common-defect-mechanisms Reflow soldering is the dominant joining process in surface mount technology. Understanding the thermal profile, solder paste behaviour and oven design is essential for achieving reliable, defect-free solder joints at scale. Fri, 23 Oct 2026 11:32:50 GMT Smt-2017 https://epp-europe-news.com/artikel/delvitech-showcases-ai-native-horus-inspection-system-at-productronica-india-2026-c4a59c https://epp-europe-news.com/artikel/delvitech-showcases-ai-native-horus-inspection-system-at-productronica-india-2026-c4a59c Delvitech participated in Productronica India 2026 in Bangalore, presenting its Horus system with AI-native neural networks and true-3D SPI capabilities to an audience focused on quality, speed and cost challenges in a rapidly expanding electronics manufacturing market. Fri, 23 Oct 2026 06:01:23 GMT Productronica https://epp-europe-news.com/artikel/reflow-soldering-process-fundamentals-profile-design-and-common-defect-mechanisms https://epp-europe-news.com/artikel/reflow-soldering-process-fundamentals-profile-design-and-common-defect-mechanisms Reflow soldering is the dominant joining process in surface mount technology and determines joint quality, reliability and throughput in equal measure. Understanding the thermal profile, alloy behaviour and oven dynamics is essential for process engineers seeking stable, defect-free results. Thu, 22 Oct 2026 11:31:06 GMT Smt-news-highlights https://epp-europe-news.com/artikel/tri-s-tr7600fb-sii-3d-axi-system-receives-2026-mexico-technology-award-68f31b https://epp-europe-news.com/artikel/tri-s-tr7600fb-sii-3d-axi-system-receives-2026-mexico-technology-award-68f31b Test Research Inc. (TRI) has announced that its TR7600FB SII AI-assisted 3D Automated X-ray Inspection system won the 2026 Mexico Technology Award in the AXI Inspection category, presented at a ceremony preceding SMTA Guadalajara 2026 on 7 October in Guadalajara, Jalisco. Thu, 22 Oct 2026 11:00:58 GMT Aoi-axi https://epp-europe-news.com/artikel/micron-invests-in-indium-corporation-to-restart-domestic-critical-minerals-processing-for--bb26e0 https://epp-europe-news.com/artikel/micron-invests-in-indium-corporation-to-restart-domestic-critical-minerals-processing-for--bb26e0 Micron Technology has announced a strategic investment in Indium Corporation as part of its up to $3 billion U.S. supply-chain programme, targeting the restart of domestic critical minerals processing essential to advanced memory manufacturing. Wed, 21 Oct 2026 11:01:04 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/nordson-sonoflex-acoustic-system-wins-best-of-west-award-at-semicon-west-2026-3ffe6d https://epp-europe-news.com/artikel/nordson-sonoflex-acoustic-system-wins-best-of-west-award-at-semicon-west-2026-3ffe6d Nordson Test & Inspection's SonoFlex automated acoustic inspection system has received the 2026 Best of West Award, presented by SEMI Americas and Semiconductor Digest at SEMICON West 2026, recognising its advanced throughput, sensitivity and modular design for panel-level semiconductor inspection. Wed, 21 Oct 2026 06:01:02 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/agileo-automation-expands-north-american-distribution-for-e84-compliance-test-solution-9dbf97 https://epp-europe-news.com/artikel/agileo-automation-expands-north-american-distribution-for-e84-compliance-test-solution-9dbf97 Agileo Automation has named Semitorr – CTW Solutions as North American distributor for its combined E84 PIO Box and Speech Scenario solution, enabling semiconductor equipment compliance testing against SEMI E84 and GEM300 standards in wafer fabs. Tue, 20 Oct 2026 11:01:14 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/junkosha-introduces-1-mm-pitch-high-flex-cable-for-semiconductor-vacuum-equipment-942167 https://epp-europe-news.com/artikel/junkosha-introduces-1-mm-pitch-high-flex-cable-for-semiconductor-vacuum-equipment-942167 Junkosha has expanded its Super Low Outgassing Cable portfolio with a new 1 mm pitch configuration engineered for high-flex applications in semiconductor manufacturing equipment, announced at SEMICON West 2026. Tue, 20 Oct 2026 06:01:10 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/rena-technologies-secures-three-major-orders-for-high-throughput-wet-chemical-processing-s-c3c411 https://epp-europe-news.com/artikel/rena-technologies-secures-three-major-orders-for-high-throughput-wet-chemical-processing-s-c3c411 RENA Technologies has received three additional major orders for high-throughput wet-chemical processing platforms covering both 200 mm and 300 mm wafer formats, with installations planned across multiple global regions. Mon, 19 Oct 2026 11:00:56 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/indium-corporation-s-halogen-free-solder-paste-indium12-9hf-wins-mexico-technology-award-e20e8f https://epp-europe-news.com/artikel/indium-corporation-s-halogen-free-solder-paste-indium12-9hf-wins-mexico-technology-award-e20e8f Indium Corporation's Indium12.9HF no-clean, halogen-free solder paste has received a Mexico Technology Award in the solder paste category, recognised for its performance in fine-aperture printing and high-density assembly applications. Mon, 19 Oct 2026 06:01:05 GMT Product-news https://epp-europe-news.com/artikel/wave-soldering-process-fundamentals-machine-concepts-and-quality-parameters https://epp-europe-news.com/artikel/wave-soldering-process-fundamentals-machine-concepts-and-quality-parameters Wave soldering remains a cornerstone technology in electronics manufacturing, particularly for through-hole components and mixed assemblies. Understanding the underlying process physics, flux chemistry and machine design is essential for achieving consistent joint quality and minimising defect rates. Fri, 16 Oct 2026 11:31:05 GMT Smt-2017 https://epp-europe-news.com/artikel/kyzen-to-present-aquanox-aqueous-cleaning-chemistries-at-smta-international-2026-8ab5e7 https://epp-europe-news.com/artikel/kyzen-to-present-aquanox-aqueous-cleaning-chemistries-at-smta-international-2026-8ab5e7 KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for electronics manufacturers. Fri, 16 Oct 2026 06:00:56 GMT News https://epp-europe-news.com/artikel/seika-machinery-showcases-pcb-routing-viscometry-and-thermal-profiling-at-smtai-2026-bb4908 https://epp-europe-news.com/artikel/seika-machinery-showcases-pcb-routing-viscometry-and-thermal-profiling-at-smtai-2026-bb4908 At SMTA International 2026, Seika Machinery will present an integrated portfolio covering PCB depanelling, solder paste viscosity measurement, reflow thermal profiling, board cleaning and EMC noise analysis — addressing several critical process-control disciplines in a single booth. Thu, 15 Oct 2026 11:01:06 GMT 3d-aoi-arena https://epp-europe-news.com/artikel/adaptsys-showcases-inline-taping-and-automated-inspection-systems-at-smta-international-20-3c51b0 https://epp-europe-news.com/artikel/adaptsys-showcases-inline-taping-and-automated-inspection-systems-at-smta-international-20-3c51b0 Adaptsys Group will present its Re-flex inline carrier tape forming system and 3DInspect automated inspection platform at SMTA International 2026, highlighting integration capabilities and traceability for tape-and-reel operations. Thu, 15 Oct 2026 06:01:22 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/kulicke-soffa-receives-2026-semi-award-for-fluxless-thermocompression-bonding-technology-36117b https://epp-europe-news.com/artikel/kulicke-soffa-receives-2026-semi-award-for-fluxless-thermocompression-bonding-technology-36117b SEMI has recognised Kulicke & Soffa with the 2026 SEMI Award for North America, citing the company's fluxless thermocompression bonding technology based on formic acid in situ oxide reduction as a key enabler for advanced heterogeneous integration. Wed, 14 Oct 2026 11:01:11 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/global-300mm-fab-equipment-spending-to-hit-227-billion-by-2029-semi-reports-dc18c9 https://epp-europe-news.com/artikel/global-300mm-fab-equipment-spending-to-hit-227-billion-by-2029-semi-reports-dc18c9 SEMI projects global 300mm front-end fab equipment spending to reach $149 billion in 2026 and climb to $227 billion by 2029, with 20 new fabs or lines beginning construction this year alone. Wed, 14 Oct 2026 06:01:04 GMT Semiconductor-packaging https://epp-europe-news.com/artikel/scienscope-to-exhibit-ai-x-ray-counting-inventory-management-and-smart-storage-at-smta-int-fd5465 https://epp-europe-news.com/artikel/scienscope-to-exhibit-ai-x-ray-counting-inventory-management-and-smart-storage-at-smta-int-fd5465 Scienscope International will present four product lines at SMTA International 2026, covering AI-powered X-ray component counting, automated inventory tracking, X-ray inspection and moisture-sensitive component storage. Tue, 13 Oct 2026 11:01:05 GMT Aoi-axi