Indium Corporation, the Clinton, N.Y.-based specialist in high-reliability soldering, sintering and thermal interface materials, is sending three subject-matter experts to PCIM Expo 2026, taking place 9–11 June in Nuremberg, Germany. The appearances span the event's e-Mobility Stage and additional conference rooms, reflecting the breadth of application areas in which advanced solder and thermal materials are now critical.
The first presentation, scheduled for Tuesday 9 June at 14:35 CEST, focuses on thermomechanical reliability of power modules. Ryan Mayberry, Senior Applications Development Engineer for Indium's Engineered Solder Materials (ESM) group, will co-present with Klaus Hoell, Team Leader Thermal Management & Innovation at Schunk Carbon Technology GmbH. The talk examines Aluminum-Graphite baseplates in combination with Indium's Indalloy 276 InFORMS solder preforms, evaluating assembly process considerations and thermal shock performance against established industry standards. As power densities continue to rise in inverter and converter designs, baseplate material selection and die-attach solder choice become increasingly interlinked variables.
On Wednesday 10 June at 14:10 CEST, Andreas Karch, Regional Technical Manager and Technologist for Advanced Applications at Indium Corporation, will present alongside Syeda Qurat ul ain Akbar, Senior Staff Product Applications Engineer at Infineon Technologies AG. Their session addresses materials technologies for next-generation power distribution in AI data centre infrastructure — a segment placing exceptional demands on device-to-heat-sink interconnects and thermal interface layers. A case study on device-to-heat-sink soldering is included, demonstrating measurable improvements in thermal performance relevant to high-current power distribution modules now being deployed in hyperscale computing environments.
The third session, on Thursday 11 June at 14:20 CEST, covers Transient Liquid Phase Soldering (TLPS) using solder preforms for power module packaging. TLPS is attracting growing interest in the European power electronics community because it can produce joints with remelt temperatures significantly higher than the original process temperature, a property valuable for stacked die and multi-chip module architectures where sequential assembly steps would otherwise reflow earlier joints.
PCIM Expo is the principal European exhibition and conference for power electronics, intelligent motion and energy management, making it a natural platform for material suppliers targeting the automotive, industrial and data infrastructure sectors. Indium Corporation's participation reflects a broader industry trend in which solder material chemistry, preform geometry and substrate material selection are being engineered together rather than optimised in isolation, particularly as silicon carbide (SiC) and gallium nitride (GaN) devices push junction temperatures and thermal cycling severity beyond the limits that conventional tin-silver-copper alloys were originally qualified to handle.
European electronics manufacturers evaluating next-generation power module assembly processes can access the full session schedule and registration details through the PCIM Expo 2026 website. Indium Corporation's technical documentation on Indalloy 276 InFORMS and related preform products is available directly from the company.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-experts-address-power-electronics-and-thermal-management-solutions-at-pcim-expo-2026/
