Clinton, N.Y.-based Indium Corporation announced on 23 April 2026 its membership in the IDSPS program, a four-way partnership framework involving the government of India, state governments, academic institutions, and global industry partners. The consortium has engaged approximately 50 faculty from institutions including IITs, IISc and BITS, alongside 50 global companies, to develop 12 strategic technology hubs across India.
Indium Corporation's involvement focuses on advanced materials and assembly processes relevant to semiconductor packaging, with the company aiming to help bridge academic curricula and industrial practice in areas such as materials performance and reliability. Principal Engineer Andy Mackie, Ph.D., will lead the company's engagement, building on prior outreach visits to Indian institutions.
The IDSPS partnership extends Indium Corporation's existing global university and consortium collaborations and aligns with its stated focus on advanced packaging materials and assembly solutions targeting 2030 technology roadmaps.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-joins-indias-idsps-industry-consortium-partnership/
