Indium Corporation will participate in the IEEE Electronic Components and Technology Conference (ECTC), scheduled for 26–29 May 2026 in Orlando, Florida. The Clinton, N.Y.-based materials supplier will use the event to present its portfolio of products targeting power device packaging, flip-chip assembly, and die-attach applications.
Among the highlighted flip-chip flux offerings is NC-809, a no-clean, ultra-low-residue flux engineered for dual-purpose use in flip-chip and BGA ball-attach processes. The product combines high-tack characteristics with strong wetting capability. A second flux, WS-446HF, is a halogen-free, water-washable formulation intended to address complex assembly scenarios requiring a single cleaning step. It supports BGA ball-attach and flip-chip dipping applications for sphere sizes of 0.25 mm and above, and is qualified for challenging substrate metallizations including Cu OSP, ENEPIG, and ENIG. According to Indium Corporation, WS-446HF is designed to reduce non-wet open defects, missing balls, and electrochemical migration.
In the sintering paste segment, Indium Corporation features two Cu sinter materials. InBAKE 29 is formulated for pressureless, batch oven sintering in power discrete die-attach applications where high thermal conductivity, high electrical conductivity, and elevated operating temperatures are required. InFORCE 29 is a range of pressure Cu sinter pastes targeting applications with similarly demanding reliability and thermal performance requirements, including die-attach for power modules.
The company also presents SiPaste C312HF, a cleanable solder paste developed for fine-aperture stencil printing. Indium Corporation states the material delivers consistent transfer efficiency and a stencil life of at least four hours without dry-out. Post-reflow residues are described as non-corrosive and can be left in place or removed using semi-aqueous or saponifier cleaning processes.
ECTC is a primary technical forum for electronic components, packaging, and interconnect technologies organised by the IEEE Electronics Packaging Society. The conference draws suppliers and engineers active in semiconductor packaging, advanced assembly, and related materials disciplines — areas where European electronics manufacturers increasingly source materials and process knowledge as packaging complexity grows with wide-bandgap semiconductor adoption and miniaturisation trends in power electronics.
Indium Corporation's participation at ECTC 2026 reflects continued industry focus on materials optimised for next-generation power device packaging, an area of growing relevance to European EMS providers and Tier-1 automotive and industrial electronics manufacturers integrating SiC and GaN devices into production lines.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-highlight-power-device-packaging-solutions-at-ectc-2026/
