Indium Corporation has confirmed its participation at Productronica India 2026, scheduled for 16–18 September in Bengaluru. The Clinton, New York-based solder materials specialist will field a team of manufacturing and technical experts to present its portfolio of high-performance solder pastes, low-silver alloy systems, and thermal interface materials to the Indian electronics manufacturing community.
Central to the exhibition will be the company's Durafuse technology platform, a patented solder paste alloy system designed to address reliability challenges in complex PCB assemblies. Two variants are being highlighted. Durafuse LT targets large BGA assemblies susceptible to temperature-induced warpage or uneven heating during reflow, reducing peak reflow temperatures while maintaining thermal cycling and drop-shock performance — a combination relevant to consumer electronics and portable device manufacturing. Durafuse HR, by contrast, is positioned for high-reliability segments such as automotive and mobile infrastructure, offering enhanced thermal cycling performance across the -40°C to +125°C and -40°C to +150°C ranges as well as improved voiding control.
On the fine-feature side, Indium Corporation will present Indium12.9HF, a no-clean, halogen-free solder paste formulated for miniaturised component geometries including 01005 and 008004 passives. The company states the product delivers high stencil print-transfer efficiency and low voiding performance at BGA, CSP, LGA, and QFN pads down to 175 microns in air reflow — characteristics directly relevant to the SPI yield challenges that surface mount assemblers face as component pitches continue to shrink.
A complementary product, Indium10.1HF, is an air-reflow, no-clean, halogen- and lead-free solder paste specifically engineered for ultra-low voiding on designs incorporating large ground pads. Its flux chemistry is described as optimising electrochemical migration (ECM) resistance and Head-in-Pillow (HIP) defect performance while providing stable wetting behaviour.
The Productronica India event serves as a regional counterpart to the established Productronica Munich fair and has grown into a significant platform for electronics manufacturing suppliers targeting the subcontinent's expanding EMS and ODM base. India has become an increasingly strategic market for global solder materials companies as domestic and multinational manufacturers scale PCB assembly capacity, driven in part by supply chain diversification trends affecting the broader Asia-Pacific region.
Indium Corporation's participation reflects a wider pattern among Western materials suppliers investing in direct technical support structures in India rather than relying solely on distribution partnerships. The company's stated presence of local manufacturing and technical experts in the country suggests a longer-term market development commitment beyond trade show participation alone.
Visitors to the Indium Corporation stand at Productronica India will be able to discuss specific alloy selection criteria, process optimisation, and thermal interface material requirements with the company's specialists.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-highlight-high-reliability-solder-low-silver-and-thermal-management-solutions-at-productronica-india/
