Ryan Mayberry, Senior Applications Development Engineer for Indium Corporation's Engineered Solder Materials (ESM) division, will present 'Addressing the Challenges of Metal Thermal Interface Materials in Large Area, High Thermal Design Power xPU Packages for AI, HPC, and Data Centers' on 8 July at IMAPS ThermCon 2026. The presentation examines the shift from polymer-based TIMs to high-bulk-thermal-conductivity metal alternatives, with focus on thermal design power management, package warpage, and system architecture compatibility.
The session argues that implementing a high-conductivity, low-interfacial-resistance metal TIM can reduce overall thermal resistance in advanced semiconductor packages, provided key integration challenges are resolved. Co-author Kyle Aserian, also an Applications Development Engineer at Indium Corporation's ESM group, contributed to the research. The findings are relevant to European electronics manufacturers and assembly houses working with advanced packaging for AI accelerators and data-centre hardware, where thermal management at the package level is an increasingly critical design constraint.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-expert-to-present-tims-solutions-for-ai-thermal-challenges-at-imaps-thermcon/
