At SEMICON Taiwan 2026, Indium Corporation is highlighting materials technologies designed for heterogeneous integration and advanced semiconductor packaging. Featured products include WS-641 flux for fine-pitch microbump flip-chip assembly, ball attachment solutions, DI water-cleaning-compatible materials, and the patented Durafuse LT solder alloy, developed for demanding fine-pitch applications where warpage control and reliability are critical.
The company positions its portfolio as production-ready for the complex requirements of AI and HPC packaging, including higher power density, tighter thermal budgets, and the need for improved manufacturing yield. President and CEO Ross Berntson stated that next-generation AI performance depends on the full system — from interconnect and package to thermal and power delivery — and that proven, scalable materials directly impact yield and time to market.
Taiwan's integrated semiconductor ecosystem, spanning leading-edge fabs, OSATs, OEMs, and advanced packaging infrastructure, represents a key market for Indium Corporation's specialty materials. The company's focus on PPAC optimisation aligns with ongoing industry demands across the European and Asia-Pacific electronics manufacturing supply chains.
Quelle: Indium Corporation – https://www.indium.com/press-releases/beyond-the-chip-indium-corporation-highlights-ai-materials-solutions-at-semicon-taiwan-2026/
