At IMAPS Symposium 2026, Indium Corporation experts will present on 30 September across three sessions. Sze Pei Lim covers novel interconnect materials including ultra-low residue flux formulations for flip-chip-attach compatible with underfill and molding compounds, a fluxless soldering adhesive agent, and solder paste for ultra-fine-pitch printing — targeting high-density SiP, TCB, LAB, and 2.5D module applications. Jason Chou addresses AI/HPC packaging from wafer bumping to system assembly, presenting ultra-low residue flux for micro-bump and Chip-on-Wafer processes, mid-temperature solder pastes to eliminate Head-in-Pillow and Non-Wet-Open defects, and advanced thermal interface materials (TIMs) for HPC chips.
A third session by R&D Director Hongwen Zhang, Ph.D., introduces a bismuth-free, indium-containing lower-temperature solder targeting large BGA assembly for HPC — a material category attracting significant industry attention as package sizes and thermal budgets increase. The presentations reflect broader industry efforts to qualify new solder and flux chemistries that meet the reliability and density demands of heterogeneous integration platforms.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-experts-to-present-advanced-packaging-ai-and-high-performance-computing-materials-solutions-at-imaps-symposium/
