Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Semiconductor-packaging/Artikel
    Indium Corporation Receives $3.2 Million DOE Grant for Domestic Gallium Recovery
    Foto: Indium Corporation
    Semiconductor-packaging

    Indium Corporation Receives $3.2 Million DOE Grant for Domestic Gallium Recovery

    TRACE-Ga initiative targets high-purity gallium extraction from manufacturing by-products at Rome, NY facility
    Veröffentlicht
    01. September 2026
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    Indium Corporation announced it has received a $3.2 million grant from the U.S. Department of Energy's Office of Critical Minerals and Energy Innovation (CMEI) as one of five organisations selected under the Technology for Recovery and Advanced Critical-material Extraction – Gallium (TRACE-Ga) initiative. The programme targets rapid prototyping of novel gallium recovery technologies from U.S. metal processing feedstocks. The U.S. has had no domestic gallium production since 1987 and remains fully import-dependent for the material.

    Gallium is a key enabler in compound semiconductors, LEDs, solar cells, and RF devices central to advanced electronics manufacturing. Work will be conducted at Indium Corporation's Rome, New York facility, which already hosts metal-processing infrastructure and analytical capabilities. The project will leverage electrochemical methods and advanced purification processes applied to gallium-bearing scraps generated during the company's existing production of gallium metals, alloys, and compounds including gallium trichloride and gallium oxide.

    For the European electronics manufacturing supply chain, securing alternative gallium sources carries direct relevance given ongoing export restrictions from dominant producing nations. A validated domestic U.S. recovery process could influence global gallium availability and pricing for semiconductor and SMT-related materials.

    Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-awarded-3-2-million-doe-grant-to-establish-domestic-gallium-supply-chain/

    Mehr aus Semiconductor-packaging

    Weitere aktuelle Artikel aus der Rubrik Semiconductor-packaging.

    Alle Semiconductor-packaging-Artikel
    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon PolymerizationFoto: Brecht Corbeel / Unsplash
    Semiconductor-packaging

    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon Polymerization

    11. November 2026

    Nanoscribe has detailed its range of photoresins engineered for Two-Photon Polymerization (2PP) and Two-Photon Grayscale Lithography (2GL), targeting high-precision micro-optics manufacturing on silicon, glass, and…

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour ThroughputFoto: Canon Europe (semicon)
    Semiconductor-packaging

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour Throughput

    10. November 2026

    Canon has announced the FPA-6400ES6a KrF scanner for semiconductor lithography, combining a throughput of 400 wafers per hour with industry-leading overlay accuracy of 4.0 nm and the ability to handle wafer warpage of…

    Fabmatics absorbs SCI business activities under unified brandFoto: Ludovico Ceroseis / Unsplash
    Semiconductor-packaging

    Fabmatics absorbs SCI business activities under unified brand

    6. November 2026

    Fabmatics has integrated the business activities of SCI under the Fabmatics brand, consolidating the acquired expertise within its semiconductor automation portfolio.

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash MemoryFoto: Louis Reed / Unsplash
    Semiconductor-packaging

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash Memory

    6. November 2026

    Entegris and Kioxia are deepening their strategic partnership to co-develop materials and process technologies for future BiCS FLASH 3D NAND architectures, using AI, digital-twin modelling and experimental validation at…

    ← Zurück zu Semiconductor-packagingZur Startseite