Indium Corporation will use SEMICON SEA 2026 in Kuala Lumpur to spotlight materials targeting AI and next-generation power electronics manufacturing. Featured products include Formic Acid Soldering Technology (FAST) — a flux-free reflow method suited to power device packaging — offered in preform, InFORMS and solder paste formats. The Heat-Spring compressible indium-based thermal interface material, rated at 86 W/mK for TIM2 applications, is also on show alongside InFORCE 29 pressure copper sinter pastes for die-attach of Si and SiC power devices and substrate-attach of power modules to coolers.
On the solder materials side, Indium Corporation will present Durafuse LT, a low-temperature solder paste alloy designed for step soldering processes involving large BGAs with complex warpage profiles. The company states it outperforms conventional BiSn and BiSnAg alloys and can match SAC305 with optimised process parameters. The SiPaste series, formulated with Type 5 to Type 8 fine powders for fine-feature stencil printing, rounds out the exhibit, targeting void reduction and consistent transfer efficiency in high-density semiconductor packaging applications.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-showcase-high-performance-ai-application-solutions-at-semicon-sea-2026/
