Indium Corporation will present findings on advanced metal thermal interface materials (TIMs) and their interaction with liquid-cooled cold plates at the Open Compute Project (OCP) Global Summit, scheduled for 12–15 October 2026 in San Jose, California. Ryan Mayberry, Senior Applications Development Engineer within the company's Engineered Solder Materials (ESM) division, will deliver the session titled 'Latest Advancements with Thermal Interface Materials' on 15 October.
The presentation centres on test data generated in collaboration with CoolIT Systems, quantifying how liquid metal TIMs and liquid-cooled cold plate designs interact across the full thermal stack — from the silicon die interface through the cooling loop to data centre-level performance metrics. According to Indium Corporation, the study demonstrates that a 10°C reduction at die level propagates through the cooling architecture, increasing thermal headroom and enabling higher coolant operating temperatures.
From an infrastructure perspective, the findings indicate that such a temperature reduction can lower cooling energy demand and improve efficiency metrics including Power Usage Effectiveness (PUE) and compute performance per watt. These parameters are increasingly scrutinised as AI accelerator clusters and high-performance computing (HPC) deployments drive thermal loads beyond the capabilities of conventional air-cooled solutions.
Liquid metal TIMs — typically indium-based or gallium-based alloys — offer substantially lower thermal resistance than polymer-based alternatives, making them candidates for direct die-attach applications in advanced packaging configurations. The co-optimisation approach presented by Indium Corporation and CoolIT Systems addresses the complete thermal pathway rather than individual components in isolation, which is relevant for engineers designing cooling architectures for large-scale GPU and custom AI accelerator modules.
Mayberry leads the application development team for the ESM product line at Indium Corporation, focusing on power electronics and thermal management. His work spans process recommendations, test platform construction, prototype assembly, and new product introduction support — activities directly tied to the qualification workflows common in electronics manufacturing for demanding thermal applications.
Founded in 1934 and headquartered in Clinton, New York, Indium Corporation supplies solder and flux materials, brazes, TIMs, sputtering targets, and specialty metals including indium, gallium, germanium, and tin to the global electronics, semiconductor, and thermal management markets. The company operates manufacturing and technical support facilities across China, Germany, India, Malaysia, and other locations. Further information on the company's TIM portfolio is available at indium.com.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-expert-to-present-thermal-management-strategies-for-next-generation-ai-applications-at-ocp-global-summit/
