Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Hersteller/OCP

    OCP

    Alle Meldungen, Produkte und Entwicklungen rund um OCP.

    1 Meldung

    Indium Corporation to Present Liquid Metal TIM and Cold Plate Co-optimisation Data at OCP Global SummitFoto: Shoeib Abolhassani / Unsplash
    Semiconductor-packaging

    Indium Corporation to Present Liquid Metal TIM and Cold Plate Co-optimisation Data at OCP Global Summit

    9. Oktober 2026

    Indium Corporation's Senior Applications Development Engineer Ryan Mayberry will present test data on liquid metal thermal interface materials and liquid-cooled cold plate co-optimisation at the OCP Global Summit,…

    Newsletter

    EPP Europe Newsletter

    The most important electronics-manufacturing news delivered to your inbox.

    Jetzt anmelden