At the Expo for Electronics Manufacturing (EFX), 6–8 October 2026 in Stuttgart, Indium Corporation Regional Technical Manager Andreas Karch will present 'Energy Efficiency in the Soldering Process', developed in partnership with SMT Thermal Discoveries. The session focuses on Indium Corporation's Durafuse LT mixed-powder alloy, which reflows at approximately 200–210°C, paired with the SMT Thermal Discoveries SMT R320 convection reflow oven, engineered for optimised heat transfer and reduced energy draw.
Testing of the combined solution demonstrated a 25% reduction in power consumption, annual energy costs, and CO₂ emissions relative to SAC305 reflowed in a standard reflow oven — a concrete data point for electronics manufacturers evaluating sustainability measures without compromising process reliability. Karch provides technical support across the DACH region and covers Indium Corporation's full portfolio of solder pastes, preforms, fluxes, and thermal management materials.
The presentation is scheduled for 6 October at 13:00 CEST. Indium Corporation can also be met at EFX Booth 9A79. Further information on Durafuse LT technology is available at indium.com.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-smt-thermal-technologies-to-demonstrate-manufacturing-energy-savings-through-low-temperature-reflow/
