Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with conventional SAC305 reflow. The presentation takes place at EFX 2026 in Stuttgart on 6 October.
ITW EAE has received a 2026 New Product Introduction Award for the Electrovert EcoWave, an option for its wave soldering machine platform.
Omron Inspection outlines an end-to-end barcode reading and sensing approach designed to provide full visibility across electronics production processes, supporting traceability requirements in smart factory…
Cybord and Siemens Digital Industries Software have signed an expanded OEM agreement to embed Cybord's visual AI component analytics platform into Siemens' Opcenter MES, targeting quality control in SMT production lines.
Cybord's AI-based platform leverages images captured by pick-and-place machines to inspect components for defects, markings and provenance data, targeting IPC-aligned component-level traceability in PCB assembly.
Acquisition to accelerate time-to-market for AI and data center devices
Cybord CEO Oshri Cohen spoke with Octopart about the company's AI-driven component inspection technology and its role in tackling supply chain challenges, including counterfeit parts and component scarcity.
Cybord has announced a fully air-gapped version of its Visual AI component analytics platform, enabling organisations operating restricted or closed networks to run advanced inspection and traceability capabilities…
In March, the Global Electronics Association announced the recipients of the Best Technical Paper awards. Presented at the Advanced Electronic Packaging
A breakthrough in advanced packaging materials has been announced with the introduction of TM230D, an innovative 3-in-1 sintering material designed to
Manufacturers today are navigating an increasingly complex balancing act. High-mix production, persistent labour shortages, and stricter safety and The case for semi-automated bin picking
The Spanish Metrology Centre (Centro Español de Metrología, CEM) recently became the first European customer to install a Mitutoyo LEGEX TAKUMI machine.
Siemens and NVIDIA have announced a significant expansion of their strategic partnership to bring artificial intelligence into the real world. Together,
SICK Hungary promotes manufacturing excellence in Eastern Europe. As the largest production site in the SICK concern, the company’s Hungarian facility has
HumiSeal, a leading manufacturer of conformal coatings and encapsulation materials and part of Chase Corporation, has announced the expansion of its
Industrial automation is facing a paradigm shift: machines, robots, and mobile systems are learning to “understand” space. With the new OPC UA Companion
There are just a few more weeks to go before the anniversary edition of productronica. The world’s leading trade fair for the development and production
Since the 1980s, System Electronics, a Coesia brand based in Modena, Italy, has been a driver of innovation with its wide range of high-quality products
Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, has announced a major performance upgrade to its Jet-on-the-Fly High Speed
Semiconductors are essential for electronic components, and demand is growing
Despite the ongoing artificial intelligence (AI) revolution and widespread publications of AI advancements, experts emphasize that implementation in
Semiconductor Climate Consortium announces 2025 initiatives