Currently, semi-automated systems that require manual support are still widely used in semiconductor factories, and this has consequences: Gaps in automation lead to efficiency losses and increase the error rate, in an industry that has little tolerance for either due to high quality requirements, sensitive materials and tight schedules. A central and particularly critical step in this respect is the packaging of wafers for transportation, as it is crucial for the integrity of the products. With the ABT (Auto Bagging Tool), the German expert for process automation and production automation cts offers a compact and flexible solution that fully automates packaging and combines it with precise inspection and labeling technology: from identification and leak testing to documented labeling.
Adaptable to different carriers, seamless integration into existing production lines
“The ABT system is highly adaptable and therefore suitable for FOSBs, FOUPs or other carriers such as wafer boxes, SFS or HWS,” explained Alfred Pammer, VP Sales/Marketing/Product Management at the company. “Up to 570 FOSBs per day can be packaged thanks to minimal cycle times.” The result is safe, quality-tested and reproducible packaging in accordance with individual production standards. Errors that potentially occur during manual packaging and lead to rework, rejects or production downtime and cause considerable additional costs can be avoided by using the ABT. The safe packaging also minimizes the risk of damage or contamination during transport. „The ABT system can be seamlessly synchronized with existing host systems without major adjustments. Using SECS/GEM, it communicates directly with the respective system and automatically transfers all inspection results, labeling data and container IDs“, explains Alfred Pammer. “Remote image and video monitoring also take the strain off the operators and enable 100% traceability.”
Four steps to the fully packaged FOSB or FOUP
With the ABT, the packaging process consists of four steps: The first step includes identification and slot verification. FOSBs or FOUPs are individually identified via RFID. Using integrated cross-slot checks, the system automatically detects incorrect assignments or slot overlaps. This prevents misplacements and protects process stability.
The next step is the automated, 100% leak testing and inspection. Here, each packaging unit is checked on a product-specific basis. Leaks are detected and automatically sorted out, including digital documentation. This ensures that only securely sealed FOSBs or FOUPS are dispatched.
Next comes the labeling and setting up traceability. In this third step, all packaging units automatically receive a tamper-proof label with a serial number, time stamp and test result in compliance with cleanroom requirements. Container movements can be tracked via SECS/GEM. All information is also stored digitally and is available for MES, ERP or auditing.
