Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Top-news/Artikel
    Redefining solder paste application
    Bildquelle nicht angegeben
    Top-news

    Redefining solder paste application

    Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, has announced a major performance upgrade to its Jet-on-the-Fly High Speed
    Veröffentlicht
    10. November 2025
    Lesezeit
    2 Minuten
    Rubrik
    Top-news

    Designed for flexibility, accuracy, and digital manufacturing efficiency, the company’s solder paste jetting solution is available on all platforms — the Spider and Tarantula dispensing systems, and the FOX Ultra and PUMA Ultra All-in-One machines.

    With the company’s intelligent Gerber file import, users can move from digital design to production in no time, as recipes can be automatically prepared for any new project, eliminating manual programming and setup delays.

    Two ways to use solder paste jetting

    Complement your stencil printer – for complex or selective applications:

    • Eliminate stepped stencil designs
    • Apply solder exactly where needed
    • Perfect for ultra-fine pitch and special components

    Replace the stencil printer entirely – for a fully digital, stencil-free process:

    • No tooling, no cleaning, no delays
    • Less waste, instant product changeover
    • Ideal for high-mix SMT lines and prototype-to-production workflows
    • Solder Paste application in cavities or different Z-levels seamlessly

    Technical performance

    The upgraded system delivers up to 1.1 million dots per hour at peak frequency. In real production conditions, users can achieve an average of 350,000 dots per hour on typical boards and up to 665,000 dots per hour on dense BGA patterns. Each dot can be dispensed with volumes between 1.8nL to 80nL, ensuring perfect repeatability and accuracy across every pad and component. With jetting performance capable of feeding Pick & Place systems up to 50,000 cph, the technology offers unmatched process integration — from prototyping to full-scale production.

    Meet Essemtec at productronica 2025

    Industry professionals are invited to experience the high-speed solder paste jetting in live demonstrations at productronica 2025. The trade fair is taking place from 18 to 21 November in Munich, Germany, and Essemtec will be exhibiting at Booth A3.261.

    “This performance leap takes solder paste jetting to a whole new level — combining speed, flexibility, and automation to empower modern electronics manufacturing,” commented Olivier Carnal, Essemtec General Manager.

    https://essemtec.com/

    Mehr aus Top-news

    Weitere aktuelle Artikel aus der Rubrik Top-news.

    Alle Top-news-Artikel
    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026Foto: Indium Corporation
    Top-news

    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026

    7. Oktober 2026

    Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with…

    ITW EAE Electrovert EcoWave Wins 2026 NPI AwardFoto: Bermix Studio / Unsplash
    Top-news

    ITW EAE Electrovert EcoWave Wins 2026 NPI Award

    1. Oktober 2026

    ITW EAE has received a 2026 New Product Introduction Award for the Electrovert EcoWave, an option for its wave soldering machine platform.

    Omron Promotes End-to-End Barcode Reading and Sensing for Production TraceabilityFoto: Edgar Cornejo / Unsplash
    Top-news

    Omron Promotes End-to-End Barcode Reading and Sensing for Production Traceability

    8. September 2026

    Omron Inspection outlines an end-to-end barcode reading and sensing approach designed to provide full visibility across electronics production processes, supporting traceability requirements in smart factory…

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and TraceabilityFoto: Cybord
    Top-news

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and Traceability

    6. September 2026

    Cybord has announced a fully air-gapped version of its Visual AI component analytics platform, enabling organisations operating restricted or closed networks to run advanced inspection and traceability capabilities…

    ← Zurück zu Top-newsZur Startseite