Above all, the winning entries highlighted advances in solder reliability, microvias, contamination control, and IC substrate integrity, commented Matt Kelly, CTO and Vice President of standards and technology and APEX EXPO Conference General Chair, Global Electronics Association.
Technical papers presented at the Advanced Electronic Packaging Conference are evaluated based on originality, technical depth, industry relevance, and overall quality. Selected by members of the Technical Program Committee, the awards recognize exceptional research, technical rigor, and meaningful contributions to electronics manufacturing and advanced packaging. The conference serves as the premier forum for engineers, researchers, and subject-matter experts to share data-driven insights that shape the future of component- to system-level integration in electronics manufacturing.
Best student paper
“Connecting Microstructural Damage to Electrical Performance in Lead Free Solder Joints”. Authors: Dorottya Varga, Robert Bosch, Budapest. Co-authors: Gabor Belina and Gabor Jokai, Robert Bosch, Budapest.
This paper examines the relationship between microstructural degradation mechanisms and electrical performance in lead-free solder joints, providing critical insight into reliability performance in modern electronic assemblies.
Best nextgen paper
“Rethinking Area Ratio: A Physics-Based Model for Predicting Solder Paste Transfer Efficiency for Thin Stencils”. Author: Gayle Towell, AIM Solder, USA.
This research challenges traditional stencil design assumptions by introducing a physics-based model to predict solder paste transfer efficiency, offering improved process predictability for ultra-thin stencil applications.
Best of conference awards
“Evaluation of Microvia Direct Plated Copper in Comparison to Traditional Electroless Plating”. Author: Nicole Carpentier, The Aerospace Corporation, USA. See the website for a full list of co-authors.
This comprehensive evaluation compares direct plated copper to traditional electroless plating for microvias, delivering performance data relevant to high-reliability and advanced packaging applications.
“Use and Misuse of Ionic Contamination Measurements – 5 Years after Revision of IPC-J-STD-001, Chapter 8”. Author: Lothar Henneken, Robert Bosch, Schwieberdingen, Germany. Co-author: Neil Patton, Atotech UK.
Five years after the revision of IPC-J-STD-001, Chapter 8, this paper evaluates ionic contamination measurement practices, clarifying proper application and common misconceptions to support improved process control and product reliability.
“Preserving Interface Integrity in IC Substrates: A Non-Etch Approach to Wedge and Sidewall Reliability”. Author: Thomas Thomas, Ph.D., Taiwan Limited, Taoyuan, Taiwan. See the website for a full list of co-authors.
This global collaboration introduces a non-etch methodology designed to preserve interface integrity and improve wedge and sidewall reliability in IC substrates used in advanced packaging architectures.
Technical excellence in advanced electronic packaging
“The technical conference is the backbone of APEX EXPO, bringing forward the data, science, and engineering insights that move our industry ahead,” commented Kelly. “This year’s award recipients delivered research that advances fundamental understanding, while also providing practical guidance for improving reliability, performance, and manufacturing excellence in electronics,” he added.
