TM230D features thermal conductivity up to 110 W/m·K, enabling efficient heat dissipation critical for modern high-power devices. Unlike conventional sintering solutions, TM230D requires no pressure during processing, allowing manufacturers to use a standard SAC solder reflow profile for the sintering process. This simplifies manufacturing integration and enables lower processing temperatures and shorter cycle times, which helps improve production efficiency and reduce operational costs.
After sintering, TM230D forms a highly stable joint that does not re-melt even at temperatures up to 400°C, ensuring outstanding thermal stability in demanding operating environments. TM230D demonstrates superior reliability compared to traditional silver (Ag) sintering materials. The material is engineered to eliminate common cracking issues associated with Ag sintering, resulting in more robust interconnections and longer device lifetimes.
Key advantages of TM 230D include:
- 3-in-1, pressure-free sintering solution for simplified processing, compatible with standard SAC reflow profiles;
- high thermal conductivity: up to 110 W/m·K;
- lower sintering temperature and shorter process cycle;
- high thermal stability: joints remain solid up to 400 °C;
- enhanced reliability, outperforming conventional Ag sintering materials; and
- a crack-free interconnect structure.
TM 230D is ideal for power modules, automotive electronics, AI computing hardware, and other high-power semiconductor applications where thermal management and long-term reliability are critical. With its combination of simplified processing, high thermal performance, and superior reliability, TM 230D represents a significant advancement in sintering technology for the semiconductor packaging industry.
