Indium Corporation Assistant Product Manager Foo Siang Hooi will present 'Beyond Thermal Conductivity: What Really Matters for Compressible Metal TIMs' at TestConX China in Suzhou. The session examines how installation time, applied pressure, material thickness, and pattern geometry influence plastic deformation, interfacial resistance, and surface conformity — and ultimately thermal resistance — in compressible indium-based metal TIMs.
The presentation targets engineers optimising TIM configurations for AI accelerators, data centre hardware, and power electronics, where next-generation cooling demands push conventional thermal management materials to their limits. Practical guidance on assembly conditions and TIM geometry selection is intended to support both thermal performance and long-term reliability in high-power packages.
Indium Corporation supplies solder alloys, fluxes, brazes, sputtering targets, and thermal interface materials to the global electronics, semiconductor, and thermal management markets. Compressible metal TIMs based on indium are increasingly relevant in advanced semiconductor packaging where high heat flux and low contact resistance are required.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-expert-to-explore-factors-driving-performance-of-compressible-metal-tims-at-testconx-china/
