At CIPA 2026 (August 31–September 2, Wuxi, China), Indium Corporation Senior Area Technical Manager Leo Hu will deliver a presentation titled 'Co-innovation of Materials and Processes for Advanced Semiconductor Packaging.' The session examines how material selection — spanning advanced solder alloys and sintering materials — must be precisely matched to the diverse process requirements of power module packaging, particularly for devices built on wide bandgap semiconductor platforms such as SiC and GaN.
The presentation will address reliability improvement, extended device lifetime, and stable performance under extreme thermal and electrical stress, directly relevant to electrification and high-power application trends driving demand in the power electronics sector. Hu brings 20 years of semiconductor packaging experience, with specialisation in assembly technology development and materials applications, and is based at Indium Corporation's Suzhou facility.
For European electronics manufacturers sourcing materials for advanced power module assembly, Indium Corporation's portfolio covers solder pastes, fluxes, brazes, and thermal interface materials targeting next-generation packaging requirements.
Quelle: Indium Corporation – https://www.indium.com/press-releases/filling-the-gap-indium-corporation-to-present-materials-solutions-for-the-next-wave-of-power-electronics-at-cipa-2026/
