Indium Corporation has detailed its application coverage for thermal evaporation and PVD coating, positioning these processes within a broader semiconductor packaging portfolio that includes hermetic and cryogenic sealing, 2.5D and 3D packaging, flip-chip reflow, MEMS assembly, and system-in-package (SiP) integration. The company also addresses heterogeneous integration assembly (HIA) and ball-attach bump fusion as part of its offering.
On the thermal management side, Indium Corporation lists TIM1, TIM1.5 and TIM2 interface materials alongside immersion cooling solutions and semiconductor test applications, reflecting growing demand for effective heat dissipation in high-density packaging formats. Formic acid-assisted reflow soldering is also included, targeting void reduction in die-attach and flip-chip processes.
The breadth of the portfolio underscores the increasing convergence of packaging, interconnect and thermal management disciplines in advanced electronics manufacturing, an area of growing relevance for European EMS providers and semiconductor subcontractors scaling heterogeneous integration capabilities.
Quelle: Indium Corporation – https://www.indium.com/applications/thermal-evaporation-and-pvd-coating/
