Indium Corporation will participate in SEMICON SEA 2026, held 5–7 May in Kuala Lumpur, Malaysia, with two technical presentations focused on advanced materials solutions for AI and high-performance computing applications. The sessions address recurring process and reliability challenges in next-generation semiconductor packaging, an area of growing relevance to electronics manufacturers supplying into AI infrastructure.
The first session, scheduled for Monday 4 May at 15:45 MYT, is titled 'Advanced Materials Science Solutions for Next-Generation AI and Hyperscale Systems' and will be presented by Kenneth Thum, Senior Area Technical Manager at Indium Corporation, Penang. Thum's presentation covers three interconnected material categories: water-washable flux formulated for fine-pitch micro-bump processes, Durafuse LT low-temperature solder alloy aimed at reducing package warpage during assembly, and metal thermal interface materials including the company's Heat-Spring technology for extreme thermal management scenarios. The combination of these solutions is positioned to address yield loss and thermal performance limitations in advanced packaging.
The second presentation, on Thursday 7 May at 14:00 MYT, is titled 'Reflow and Reliability of InAg Soldering Thermal Interface Material With and Without Flux for TIM1 and TIM1.5 Applications.' Assistant Product Manager Foo Siang Hooi will present research evaluating indium-silver (InAg) solder thermal interface materials under multiple reflow cycles, with particular focus on void formation and reliability under thermally demanding conditions. TIM1 and TIM1.5 positions in CPU, GPU, and AI accelerator packages are subject to escalating heat flux densities, making low-voiding and high-conductivity solder TIMs increasingly critical for long-term device reliability.
The evaluation of fluxless InAg performance across reflow cycles is technically significant for packaging engineers. Eliminating flux in TIM applications reduces residue-related contamination risk at the die-to-heat-spreader interface, but requires that the alloy achieve adequate wetting and bonding through surface preparation and controlled atmosphere alone. The data presented on void formation metrics and reliability outcomes under harsh conditions provides process engineers with a basis for comparing fluxed and fluxless assembly approaches for these specific applications.
Indium Corporation's material portfolio for semiconductor packaging — spanning solder pastes, preforms, fluxes, and thermal interface materials — is widely used in advanced packaging processes including flip-chip, wafer-level packaging, and 2.5D/3D integration. The company's participation in SEMICON SEA 2026 reflects continued industry focus on the Southeast Asian semiconductor manufacturing corridor, particularly Malaysia, as a key production and R&D hub for advanced packaging. Both presentations are open to registered conference attendees.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-present-high-performance-ai-application-solutions-at-semicon-sea-2026/
