Indium Corporation has announced that its technical experts will present research findings on two advanced materials solutions at the International Conference on Electronics Packaging Technology (ICEPT) 2026, scheduled for 5–7 August in Xi'an, China.
The first presentation, scheduled for 6 August (13:00–13:25 CST), will be delivered by Hongwen Zhang, Ph.D., Research and Development Director and Principal Metallurgist. Titled 'A Review of a Bi-Free In-Containing Lead-Free Mid-Temperature Solder,' the session addresses performance characteristics of Indium Corporation's Durafuse LT solder alloy. According to the company, the material eliminates brittle bismuth-rich phases, which are a known failure mechanism in conventional low-temperature bismuth-bearing alloys, and delivers at least two orders of magnitude improvement in drop shock resistance compared to bismuth-containing alternatives. Electromigration rates are reported to be significantly reduced, with overall reliability comparable to or exceeding SAC305.
A key application highlighted in the presentation is the use of Durafuse LT in large-format BGA package assembly. The alloy's lower reflow temperature profile is said to reduce warpage-related defects, an increasingly critical consideration as package dimensions grow in advanced semiconductor packaging. Zhang is co-inventor of the Durafuse technology and has been involved in lead-free solder material development at Indium Corporation for nearly two decades.
The second presentation on 6 August will be delivered by Mary Li Ma, Senior Research Chemist, and addresses copper sintering as a die-attach solution for power electronics. Titled 'Pressure Cu Sintering Paste Developed for Next-Generation Interconnection Material,' the session introduces a copper sintering paste intended for high-power semiconductor applications. The material is reported to deliver high thermal and electrical performance with strong mechanical bonding, and notably does not require gold or silver substrate plating — a cost and process simplification relevant to power module manufacturers.
Ma's presentation will also cover advances in oxidation resistance, which has historically been a technical challenge for copper-based sintering pastes compared to established silver sintering materials. Improved shelf life and processing flexibility are cited as additional attributes positioning the paste as a viable die-attach candidate for next-generation power devices.
Copper sintering is gaining traction in power electronics as a joining technology, driven by demand for higher operating temperatures, improved thermal conductivity, and reduced dependence on precious metals. Indium Corporation's participation at ICEPT 2026 reflects the broader industry focus on materials innovation for advanced packaging, spanning both the solder alloy and sintering segments. ICEPT is a recognised forum for electronics packaging research, drawing academic and industrial contributors from across Asia, Europe, and North America.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-present-advancements-in-two-industry-defining-solutions-at-icept-2026/
