Indium Corporation received a Mexico Technology Award — sponsored by Mexico EMS magazine and judged by an independent panel — for its Indium12.9HF solder paste at the SMTA Guadalajara Tech Forum and Expo in October 2026. The no-clean, halogen-free formulation is designed for fine-pitch, high-density assemblies, addressing print transfer efficiency on apertures down to 175 microns with minimal graping or solder balling.
The paste offers high oxidation resistance suitable for thermally massive assemblies requiring soak reflow profiles, and delivers what Indium describes as best-in-class voiding performance on OSP and ENIG surface finishes. It is engineered to reduce common printing defects including HIP (head-in-pillow), insufficient solder, opens and bridging.
According to Tim Twining, VP of Sales, Marketing and Technical Service at Indium Corporation, the consistent solder volume deposition of Indium12.9HF supports improved first-pass yield and reduced scrap rates. The product sits within Indium Corporation's broader portfolio of solder materials for semiconductor packaging and electronics assembly.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-halogen-free-solder-paste-wins-mexico-technology-award/
