Indium Corporation will present at CPRIM 2026 on September 4 in Guangzhou, China. Senior Area Technical Manager Luis Pan will deliver a presentation titled 'Co-innovation of Materials and Processes for Advanced Semiconductor Packaging', focusing on how the selection and development of interconnect materials directly influence process outcomes in advanced packaging applications.
The presentation covers several specific material and process topics that are increasingly relevant to high-density semiconductor packaging. These include heat-stable fluxes designed for thermocompression bonding (TCB) and laser-assisted bonding (LAB) processes, both of which impose elevated thermal loads on flux chemistry compared with conventional reflow. Pan will also address ultra-low residue flux formulations developed for compatibility with underfill materials — a critical consideration where residue incompatibility can compromise adhesion, void formation, or underfill flow characteristics.
Additional topics include Indium Corporation's SiPaste technology, positioned for fine-pitch, high-density interconnect applications, and near-zero-residue bonding materials intended for fluxless assembly environments. Fluxless or near-fluxless assembly is of growing interest in wafer-level and chip-scale packaging where residue removal is impractical or where contamination of sensitive structures must be minimised.
The presentation speaks to a broader industry challenge: as semiconductor packaging architectures become more complex — encompassing heterogeneous integration, chiplet-based designs, and 2.5D/3D stacking — the interdependence between material formulation and process parameters becomes more consequential. Flux activation windows, residue volume, thermal stability, and compatibility with subsequent process steps such as underfilling or encapsulation all require coordinated development rather than independent optimisation.
Luis Pan manages the regional technical support team in South China and is based at Indium Corporation's Shenzhen facility. He brings 20 years of industry experience spanning SMT equipment, assembly processes, product design, and new product introduction. Pan holds a bachelor's degree in automation from Southwest University of Science and Technology and holds certifications as a project management professional and ISO 9001 internal auditor.
CPRIM 2026 is scheduled for September 4, with Pan's session taking place at 15:00–15:20 China Standard Time. Indium Corporation's broader packaging materials portfolio, including solders, fluxes, brazes, and thermal interface materials, is documented at indium.com.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-explore-the-critical-materials-and-packaging-process-connection-at-cprim-2026/
