Indium Corporation will feature five material platforms at the IMAPS Symposium in Boston. The Heterogeneous Integration Assembly (HIA) suite covers fine-powder paste, flip-chip flux, ball-attach flux and thermal interface materials (TIMs) for advanced packaging. SiPaste C312HF is a cleanable solder paste engineered for fine-aperture stencil printing, offering a minimum four-hour stencil life and compatibility with semi-aqueous or saponifier cleaning processes.
For power electronics, the company will present InFORCE 29, a pressure Cu-sintering paste for die-attach of Si and SiC power devices and substrate-attach of power modules to coolers, alongside InBAKE 29, a pressureless batch-oven Cu-sintering paste targeting high thermal and electrical conductivity in power discrete applications. Solder Thermal Interface Materials (sTIMs), optimised for BGA packages, are specified for power-dense devices exceeding 1,000 W, delivering low-void, multi-reflow-cycle reliability as an alternative to thermal greases.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-to-highlight-materials-solutions-powering-the-ai-revolution-at-imaps-symposium/
