SEMI has recognised Kulicke & Soffa with the 2026 SEMI Award for North America, citing the company's fluxless thermocompression bonding technology based on formic acid in situ oxide reduction as a key enabler for advanced heterogeneous integration.
SEMI and Semiconductor Digest have announced three finalists for the 2026 Best of West Award, to be presented at SEMICON West 2026 on 13–15 October at the Moscone Center in San Francisco. The nominated products span vacuum pump technology, acoustic inspection for panel assemblies, and AI-driven PLC engineering.
Indium Corporation's Senior Applications Development Engineer Ryan Mayberry will present test data on liquid metal thermal interface materials and liquid-cooled cold plate co-optimisation at the OCP Global Summit, demonstrating measurable efficiency gains for AI and HPC infrastructure.
SEMI Europe has joined the ReSiLient project consortium, a 48-month, €9.57 million Horizon Europe Innovation Action involving 18 partners from nine European countries. The initiative aims to reduce Europe's critical dependence on imported silicon and silicon carbide raw materials, with direct implications for semiconductor and advanced packaging supply chains.
Micross Components has entered into a definitive agreement to acquire AEMtec GmbH, a Berlin-based provider of advanced packaging, optoelectronics and test services. The deal broadens Micross' European capabilities across flip chip, 3D integration, chip-on-board and opto packaging.
Delvitech has named Eric De Mey as Chief Technology Officer of its semiconductors division, signalling a strategic push into semiconductor and microelectronics inspection with AI-based technology.
Formic acid reflow soldering eliminates the need for conventional flux, reducing residue management challenges in advanced semiconductor packaging processes including flip-chip, die-attach and SiP assembly.
Indium Corporation will present new research on two materials platforms at ICEPT 2026 in Xi'an, China: its Durafuse LT bismuth-free lead-free solder and a pressure copper sintering paste developed for high-power semiconductor applications.
At the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026 in Guangzhou, Indium Corporation will examine how precisely matching solder materials and assembly processes can address critical challenges in advanced semiconductor packaging.
The SEMI Silicon Manufacturers Group reports a 7.4% year-on-year increase in worldwide silicon wafer shipments for Q2 2026, with AI applications expanding beyond advanced logic and memory into power devices and photonics.
Indium Corporation will present advanced material solutions targeting the thermal and interconnect challenges of AI semiconductor packaging at SEMICON Taiwan, 2–4 September in Taipei. The presentation covers flux materials for Chip-on-Wafer processes, defect-reduction solder pastes and high-performance TIMs for HPC chips.
Indium Corporation will exhibit its high-reliability semiconductor packaging materials at ECTC 2026, spotlighting flip-chip fluxes, pressureless and pressure Cu sintering pastes, and a fine-aperture solder paste aimed at advanced power device assembly.
SEMI's Mid-Year Total Semiconductor Equipment Forecast projects five consecutive years of growth through 2028, with AI infrastructure investment, advanced memory, and back-end technologies including packaging and test as primary demand drivers.
Indium Corporation will deliver two presentations at SEMICON SEA 2026 in Kuala Lumpur addressing materials challenges in AI and hyperscale semiconductor packaging, including Durafuse LT low-temperature solder, Heat-Spring thermal interface technology, and fluxless indium-silver solder evaluation for CPU, GPU, and AI accelerator packages.
Indium Corporation will present next-generation semiconductor packaging material solutions at PCIM Asia 2026 in Shenzhen, covering interconnection materials and process innovations aimed at improving yield, reliability and manufacturability in power electronics packaging.
June summit in Germany to advance semiconductor integration, AI, hybrid bonding and Europe's chiplet ecosystem
Indium Corporation will exhibit its high-reliability power device packaging portfolio at PCIM Asia 2026 in Shenzhen, highlighting copper and silver sinter pastes as well as flux-free reflow solutions for next-generation power electronics manufacturing.
Indium Corporation will present findings on indium-based solder thermal interface materials (sTIMs) at IEEE ECTC in Orlando, highlighting 86 W/mK thermal conductivity and void-minimisation via fluxless vacuum formic acid reflow for high-performance computing packages.
Acquisition expands product range
Indium Corporation will showcase its AuLTRA® die-attach preform line at the International Microwave Symposium in Boston, highlighting compositions and form factors engineered for GaN power amplifiers, high-output lasers and automated laser diode assembly.
APAC region reports double-digit Electronic System Design year-over-year growth
GlThe global semiconductor industry is poised for another recordd-breaking year in 2025, with global chip sales expected to rise.