Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19 in Dresden, Germany. The Summit will deliver cutting-edge insights into the technologies and strategies shaping the future of heterogeneous systems and Europe’s semiconductor ecosystem. Registration is open.
Themed Enabling Next-Gen Heterogeneous Systems Integration, this year’s Summit will feature a program spanning geopolitical dynamics, market trends, AI hardware architectures, chiplet design, AR/VR and wearable intelligence, and the latest advancements in hybrid bonding and co-packaged optics.
“We look forward to welcoming industry leaders, innovators, and researchers to the 3D & Systems Summit 2026 in Dresden,” commented Laith Altimime, President of SEMI Europe. “As heterogeneous integration, chiplet architectures, and advanced packaging redefine system performance, the Summit provides a critical platform to align technology roadmaps, accelerate innovation, and strengthen Europe’s position in next-generation semiconductor systems.”
3D and systems summit sessions
Session 1: Market Trends and Europe’s Technological Positioning: Executive leaders will examine the shifting geopolitical dynamics reshaping semiconductor supply chains, exploring industrial policy, regional fab strategies, and global benchmarking. Speakers will assess where Europe stands today and what is required to secure technology sovereignty across critical domains.
Session 2: Advanced Packaging Capacity: From Lab Innovation to Fab Deployment: Industry experts will address the full spectrum of advanced packaging, from fan-out technologies and outsourced semiconductor assembly and test (OSAT) strategies to supply chain considerations and lab-to-fab technology transfer. The session will highlight European strengths and the steps needed to scale advanced packaging capacity regionally.
Session 3: Hybrid Bonding: Die-to-Wafer & Wafer-to-Wafer: Specialists will examine hybrid bonding as a cornerstone of high-density 3D integration, covering die-to-wafer and wafer-to-wafer techniques, DRAM stacking, reliability engineering, and integration challenges across memory, logic, and advanced packaging.
Session 4: Photonics at Scale: Co-Packaged Optics: Industry leaders will explore co-packaged optics and photonic integration as key enablers of high-bandwidth communication, AI acceleration, and energy-efficient data movement, with discussions spanning optical interconnects, quantum photonics, and high-volume manufacturing readiness.
Session 5: Design Leadership: Chiplets & System Architecture: Experts will highlight chiplet architectures, CPU startups, and 3D integration strategy, showcasing the cutting-edge design activities that are positioning Europe as an emerging leader in system-level semiconductor architectures.
Session 6: AR/VR & Wearable Intelligence: Speakers will explore the convergence of optics, photonics, packaging, and efficient computing driving the next generation of AR/VR and spatial computing platforms, from displays and imagers to optical engines and low-power compute for consumer and industrial applications.
Exhibition and business networking
The 3D & Systems Summit will feature an exclusive exhibition area showcasing industry leaders alongside innovative emerging companies, as well as business-to-business matchmaking and networking opportunities throughout the event.
The networking reception will take place at the Hilton Dresden Hotel on the first evening prior to the Summit. The networking dinner will be held aboard a historic paddle steamer on the Elbe River, following the final sessions of the first day. Networking dinner registration is reserved exclusively for 3D & Systems Summit 2026 participants.
Call for abstracts
SEMI Europe has opened the call for abstracts for the 2026 Advanced Packaging Conference (APC), inviting industry leaders, researchers, and innovators to submit presentations highlighting the latest breakthroughs in advanced packaging, testing, and heterogeneous integration technologies.
Themed Power and Interconnects Innovations Enabling AI System Performance, APC 2026 will explore how innovations such as 2.5D/3D integration, chiplet architectures, co-packaged optics, advanced materials, AI-driven design flows, and next-generation thermal and power management are enabling the future of AI, high-performance computing (HPC), automotive, and edge applications. Abstract submissions are open through July 1, 2026.
