Indium Corporation, headquartered in Clinton, New York, has announced it will exhibit its AuLTRA® die-attach solutions portfolio at the International Microwave Symposium (IMS) 2026, scheduled for 7–12 June in Boston, Massachusetts. The company positions the product line as a response to stringent reliability and thermal-management requirements in RF/microwave, 5G infrastructure and optoelectronic assembly.
Central to the showcase is AuLTRA® 75, an off-eutectic gold-tin preform with a 75Au/25Sn composition. The alloy is specifically formulated for applications where the die carries a thick gold plating layer, a configuration common in GaN-based high-power RF amplifiers used in 5G base stations and aerospace communications. According to Indium Corporation, the adjusted composition modifies the final solder joint stoichiometry compared with standard 80Au/20Sn eutectic material, improving wetting behaviour and reducing voiding. Complementary compositions at 78Au/22Sn and 79Au/21Sn are also available within the AuLTRA® 75 family.
A second highlighted product, AuLTRA® DA0001, is described by the company as a premium-grade preform tier emphasising dimensional control, edge definition and cleanliness. Key attributes include highly accurate thickness tolerance, precise edge quality and optimised surface cleanliness, with waffle-pack packaging as default. The offering is available across gold-based alloy compositions, making it relevant for contract manufacturers and IDMs handling sensitive compound-semiconductor die.
For optoelectronics assembly, Indium Corporation will feature AuLTRA® ThInFORMS®, ultra-thin preforms at 0.00889 mm (8.89 µm) in 80Au/20Sn composition. The reduced material volume addresses the well-known challenges in high-output laser die attach, specifically the risk of solder shorting and degraded thermal transfer that can occur with thicker preform geometries. Thin-preform die attach is an area of increasing relevance as laser power densities rise in industrial and datacom applications.
Rounding out the portfolio is AuLTRA® Fine Ribbon, a precision-spooled Indalloy® 182 product aimed at fully automated, high-volume laser diode assembly lines. In auto-feed dispensing systems, spool geometry consistency and ribbon length directly affect line uptime; Indium Corporation states that the product is engineered for long continuous lengths and tight dimensional tolerances to minimise production stoppages and support high-throughput processes.
From a European electronics manufacturing perspective, the AuLTRA® product line is relevant to EMS providers and semiconductor packaging houses serving automotive radar, industrial laser, space and defence radar programmes — all segments where AuSn eutectic and near-eutectic die attach remains the interconnect technology of choice due to its high-temperature stability, flux-free reflow capability and long-term reliability. The IMS 2026 exhibition provides Indium Corporation with a platform to engage directly with RF module designers whose material specifications ultimately flow down to European assembly subcontractors.
