Indium Corporation is presenting its range of semiconductor packaging materials at SEMICON Taiwan 2026, focusing on solutions for fine-pitch microbump assembly, thermal management, and advanced packaging in AI and HPC applications.
ITW EAE highlights dedicated cleaning solutions for semiconductor and wire bonding applications, targeting flux residue removal and substrate surface preparation critical to advanced packaging yield.
Indium Corporation will exhibit its materials portfolio for AI and power electronics applications at SEMICON SEA 2026 in Kuala Lumpur, 5–7 May, covering flux-free reflow, thermal interface materials, low-temperature solder pastes and pressure sintering solutions.
Indium Corporation has been awarded a $3.2 million U.S. Department of Energy grant under the TRACE-Ga initiative to develop a domestic process for recovering high-purity gallium from manufacturing by-products, addressing a critical gap in semiconductor and advanced electronics supply chains.
SEMI has announced keynotes and program highlights for SEMICON West 2026, taking place October 13–15 in San Francisco, with a focus on the semiconductor industry surpassing $1 trillion in annual revenue and the technologies driving further growth.
Indium Corporation has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a government-backed initiative linking industry, academia and government to build semiconductor manufacturing capacity in India for the AI era.
Indium Corporation will present advanced soldering and sintering material solutions for power electronics packaging at CIPA 2026, focusing on wide bandgap semiconductors and high-reliability assembly under extreme operating conditions.
Canon has announced the FPA-6400ES6a KrF scanner for semiconductor lithography, combining a throughput of 400 wafers per hour with industry-leading overlay accuracy of 4.0 nm and the ability to handle wafer warpage of up to 700 µm — capabilities aimed directly at the growing demands of 3D device integration and AI-driven chip production.
Indium Corporation is presenting collaborative INEMI research at ICEP-HBS in Hiroshima comparing SnBi and SAC305 solder alloys for first-level interconnects in advanced heterogeneous packages, with results showing significant warpage reduction using low-temperature processing.
Indium Corporation will present high-reliability metal thermal interface material solutions for next-generation electronics packaging at the China Semiconductor Packaging and Testing exhibition on 28–29 May 2026 in Jiangsu, China.
Placing 25 million LEDs in a single 4K MicroLED display with standard pick-and-place equipment would take over 200 hours. Aerotech explains how mass transfer printing, combined with precision motion systems, addresses the throughput and surface-force challenges inherent at micro-scale.
Indium Corporation experts will deliver presentations on indium-based solder thermal interface materials for AI data center ASICs and on IEC/DKE sintering standardisation efforts at the SMTA Electronics in Harsh Environments Conference in Amsterdam, 19–21 May 2026.
Indium Corporation will showcase metal thermal interface materials for AI and high-performance computing applications at the Future Industries New Materials Expo in Shanghai on 11 June 2026.
BE Semiconductor Industries N.V. (Besi) has announced Q3-2026 results showing sharp year-on-year gains across revenue, net income and orders, with hybrid bonding emerging as a primary growth driver alongside datacenter and AI-related applications.
BE Semiconductor Industries N.V. (Besi) has reported second-quarter 2026 revenue of €249.9 million and net income of €89.0 million, reflecting year-on-year increases of 68.7% and 177.3% respectively, with hybrid bonding and AI-related datacenter applications cited as primary growth drivers.
Technic has developed a High Speed Plating Test Cell designed to simulate reel-to-reel and lead frame plating in a laboratory or portable format, supporting process engineers in developing and validating electroplating chemistries ahead of full production deployment.
Besi has introduced the Datacon 8800 FC QUANTUM advX, a high-speed flip chip die bonder claiming 10,000 units per hour throughput and 4 µm placement accuracy, designed for mass reflow C2S production environments handling die sizes from 0.3 to 40 mm.
RENA Technologies addresses the growing demand for precision wet processing in photonic integrated circuit fabrication, offering equipment and chemical solutions designed around the specific requirements of photonics fabs scaling production of silicon photonics and related platforms.
Micron Technology has announced a strategic investment in Indium Corporation as part of its up to $3 billion U.S. supply-chain programme, targeting the restart of domestic critical minerals processing essential to advanced memory manufacturing.
Nordson Test & Inspection's SonoFlex automated acoustic inspection system has received the 2026 Best of West Award, presented by SEMI Americas and Semiconductor Digest at SEMICON West 2026, recognising its advanced throughput, sensitivity and modular design for panel-level semiconductor inspection.
Agileo Automation has named Semitorr – CTW Solutions as North American distributor for its combined E84 PIO Box and Speech Scenario solution, enabling semiconductor equipment compliance testing against SEMI E84 and GEM300 standards in wafer fabs.
Junkosha has expanded its Super Low Outgassing Cable portfolio with a new 1 mm pitch configuration engineered for high-flex applications in semiconductor manufacturing equipment, announced at SEMICON West 2026.
RENA Technologies has received three additional major orders for high-throughput wet-chemical processing platforms covering both 200 mm and 300 mm wafer formats, with installations planned across multiple global regions.
Adaptsys Group will present its Re-flex inline carrier tape forming system and 3DInspect automated inspection platform at SMTA International 2026, highlighting integration capabilities and traceability for tape-and-reel operations.