At the SMTA Electronics in Harsh Environments Conference in Amsterdam (19–21 May), Indium Corporation's Karthik Vijay, Senior Technical Manager for Europe, Africa and the Middle East, will present on advanced solder-based thermal interface materials (sTIMs) for high-power ASIC cooling in AI data centres. The session covers three sTIM forms — compressible patterned foils, reflowable solders and liquid metals — with indium-based sTIMs cited as delivering 86 W/mK thermal conductivity and stable long-term performance compared with traditional thermal greases and polymer phase-change materials.
A concurrent session by Andreas Karch, Regional Technical Manager and Technologist for Advanced Applications, will address the standardisation of sintering processes under IEC and DKE working group frameworks. The presentation covers pressure-assisted, pressureless and pressure sintering for SiC and GaN power electronics in automotive applications — segments where operating temperatures exceed 200°C and established industry-wide production standards are still lacking.
Both sessions reflect growing industry demand for validated materials and process standards in advanced packaging, thermal management and high-reliability power electronics — areas of increasing relevance to European electronics manufacturers navigating electrification and AI-driven infrastructure build-out.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-experts-to-address-data-center-thermal-management-and-sintering-standards-at-smta-conference/
