BE Semiconductor Industries N.V. (Besi), headquartered in Duiven, the Netherlands, has released its financial results for Q2-26 and H1-26, reporting a marked acceleration across revenue, orders and profitability metrics. The results, published on 23 July 2026, illustrate the continued momentum in advanced semiconductor packaging — a segment of growing strategic importance to the broader electronics manufacturing supply chain serving European and global OEMs.
Q2-26 revenue reached €249.9 million, a sequential increase of 35.2% versus Q1-26 and a year-on-year rise of 68.7% compared with Q2-25. For the full first half of 2026, revenue totalled €434.7 million, up 48.8% against H1-25. Net income for Q2-26 stood at €89.0 million, representing a net margin of 35.6%, compared with 21.6% in Q2-25 — an improvement the company attributes to a more favourable product mix, higher volumes and ongoing cost discipline.
Order intake in Q2-26 amounted to €292.9 million, an increase of 128.8% year-on-year and 8.6% sequentially versus Q1-26. H1-26 orders totalled €562.6 million, up 116.5% against the same period in 2025. Besi identifies hybrid bonding, photonics and AI computing as the principal demand drivers, alongside growing requirements for power management solutions targeting AI infrastructure.
From a technology standpoint, hybrid bonding is particularly significant. As a die-to-die and die-to-wafer interconnect technique enabling extremely fine pitch connections without traditional solder bumps, it is central to heterogeneous integration strategies pursued by leading chip designers and foundries. Besi has positioned itself as a key equipment supplier in this space, and the reported order trajectory suggests that volume ramp-up among major customers is progressing. Photonics integration — increasingly relevant for optical interconnects within AI datacenter architectures — represents a further growth vector that benefits Besi's die attach and bonding portfolio.
Gross margin for Q2-26 reached 65.7%, improving 2.2 percentage points sequentially and 2.4 points year-on-year. Net cash and deposits grew 58.8% versus the end of Q1-26 to reach €164.0 million at June 30, 2026, reflecting strong cash generation from operations.
For European electronics manufacturers and EMS providers, Besi's results serve as an indicator of where capital investment is flowing within the semiconductor packaging supply chain. Demand for advanced packaging equipment — encompassing hybrid bonding, flip-chip, and photonics assembly — continues to outpace conventional wire bonding. This shift has direct implications for materials suppliers, substrate manufacturers and inspection equipment vendors operating within the European electronics ecosystem, as next-generation packaging geometries impose tighter process control requirements across the entire assembly chain.
Besi is listed on Euronext Amsterdam under the ticker BESI and on OTC markets under BESIY.
Quelle: Besi (semicon) – https://www.besi.com/investor-relations/press-releases/details/be-semiconductor-industries-nv-announces-q2-26-and-h1-26-results/
