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BE Semiconductor Industries N.V. (Besi) has announced Q3-2026 results showing sharp year-on-year gains across revenue, net income and orders, with hybrid bonding emerging as a primary growth driver alongside datacenter…
BE Semiconductor Industries N.V. (Besi) has reported second-quarter 2026 revenue of €249.9 million and net income of €89.0 million, reflecting year-on-year increases of 68.7% and 177.3% respectively, with hybrid bonding…
Besi has introduced the Datacon 8800 FC QUANTUM advX, a high-speed flip chip die bonder claiming 10,000 units per hour throughput and 4 µm placement accuracy, designed for mass reflow C2S production environments…
With the merger of Besi and Datacon, a globally leading supplier of semiconductor-packaging equipment was born. How would you characterize the position
BE Semiconductor Industries/Netherlands (Besi), well-established manufacturer of assembly equipment for the semiconductor industry, has acquired