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    Startseite/Semiconductor-packaging/Artikel
    Besi Reports Strong Q3-2026 Growth Driven by Hybrid Bonding and AI Compute Demand
    Foto: Vishnu Mohanan / Unsplash
    Semiconductor-packaging

    Besi Reports Strong Q3-2026 Growth Driven by Hybrid Bonding and AI Compute Demand

    Dutch semiconductor assembly equipment maker posts €283.4 million revenue, up 113.6% year-on-year, as hybrid bonding orders more than double versus full-year 2025
    Veröffentlicht
    02. November 2026
    Lesezeit
    2 Minuten
    Rubrik
    Semiconductor-packaging

    BE Semiconductor Industries N.V. (Besi), headquartered in Duiven, the Netherlands, reported Q3-2026 revenue of €283.4 million, representing a 113.6% increase versus Q3-2025 and a sequential rise of 13.4% versus Q2-2026. Net income reached €107.2 million, up 323.7% year-on-year and 20.4% quarter-on-quarter. The figures were published on 22 October 2026 and cover the quarter ended 30 September 2026.

    Orders for the quarter totalled €342.6 million, up 17.0% sequentially and 96.1% compared with Q3-2025. Besi attributed the order growth primarily to increased demand for hybrid bonding equipment, as well as datacenter and AI-related mainstream computing applications. Year-to-date hybrid bonding orders more than doubled relative to the whole of fiscal year 2025, and cumulative unit demand for Besi's hybrid bonding systems has now exceeded 215 systems.

    Gross margin stood at 65.2% in Q3-2026, a decrease of 0.5 percentage points versus Q2-2026 but 3.0 points above the Q3-2025 level. Besi noted the year-on-year improvement was driven by a more favourable product mix and price increases. The margin came in above the company's prior guidance range.

    On a year-to-date basis, Besi's revenue and net income are up 69.0% and 179.1%, respectively, versus the same period of 2025, reflecting consistent demand growth across computing end markets including photonics and datacenter segments.

    The results underline the accelerating commercial relevance of hybrid bonding technology in advanced semiconductor packaging. Hybrid bonding — a die-to-wafer and die-to-die interconnect process that enables ultra-fine-pitch connections without conventional solder bumps — is increasingly specified for high-bandwidth memory stacks and AI accelerator packages, where interconnect density and thermal performance are critical. Besi is among the leading suppliers of production-capable hybrid bonding equipment.

    Alongside the financial results, Besi announced a new €100 million share repurchase programme. The company is listed on Euronext Amsterdam under the ticker BESI and on OTC markets as BESIY.

    Quelle: Besi (semicon) – https://www.besi.com/investor-relations/press-releases/details/be-semiconductor-industries-nv-announces-q3-2026-results/

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