Senior Area Technical Manager Leo Hu will deliver a presentation titled 'High-Reliability Metal TIM Solutions for Advanced Packaging' on 28 May at CSPT. The talk covers how metal TIMs—including pure indium and indium-based alloys—address the thermal conductivity limitations of conventional polymer-based materials through alloy formulation, interface engineering, and process control, targeting improved cooling efficiency and long-term device reliability.
Hu, based at Indium Corporation's Suzhou facility, brings over 15 years of semiconductor packaging experience, specialising in advanced assembly technology and materials applications. Indium Corporation's broader TIM portfolio sits alongside its solder, flux, braze, and sputtering target product lines, serving the global electronics and semiconductor packaging markets from manufacturing sites including Germany, Malaysia, Singapore, and the US.
Quelle: Indium Corporation – https://www.indium.com/press-releases/pushing-limits-indium-corporation-to-present-on-metal-tims-solutions-for-demanding-thermal-environments-at-cspt/
