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    Startseite/Semiconductor-packaging/Artikel
    Technic Introduces High-Speed Flow Cell for Reel-to-Reel and Lead Frame Plating Simulation
    Foto: Harrison Broadbent / Unsplash
    Semiconductor-packaging

    Technic Introduces High-Speed Flow Cell for Reel-to-Reel and Lead Frame Plating Simulation

    Portable laboratory test unit replicates production-scale electroplating conditions for process development in semiconductor packaging
    Veröffentlicht
    30. Oktober 2026
    Lesezeit
    2 Minuten
    Rubrik
    Semiconductor-packaging

    Technic, a supplier of specialty chemicals and equipment for surface finishing and semiconductor manufacturing, has introduced a High Speed Plating Flow Cell aimed at laboratory use and portable field testing. The unit is specifically designed to replicate the hydrodynamic and thermal conditions encountered in high-speed continuous plating operations such as reel-to-reel strip plating and lead frame electrodeposition.

    The flow cell is constructed from white polypropylene with an integrated support flange and a built-in storage compartment. An optional transport case allows the unit to be moved between different laboratory facilities or customer sites, which is relevant for applications engineers and process development teams working across multiple locations.

    In terms of technical configuration, the cell features a plating area of 10 inches in length by 4.5 inches in width, with adjustable controlled-depth plating ranging from 3.5 to 4.5 inches. The anode assembly comprises two stainless steel rods (3/8-inch diameter), rod holders, titanium anode baskets, and anode bags. A stainless steel cathode rod is connected to a knife-edge cathode agitation system, which is intended to simulate the relative motion between substrate and electrolyte present in continuous reel-to-reel processes.

    Solution management is handled by a double-pass PVC sparger connected to an in-tank filtration system, while a Teflon heater with digital temperature readout maintains process temperature. The unit has a footprint of 27 by 19 by 19 inches and holds approximately 1.5 gallons of plating solution. Heat-up times are specified as one hour to reach 110°F and two hours to 140°F from a 70°F ambient starting point. Power supply compatibility covers 120, 208, 230, and 240 volt single-phase at 50/60 Hz, making the unit suitable for both North American and European laboratory environments.

    From a process development perspective, such benchtop test cells serve a practical function in the semiconductor packaging and lead frame manufacturing sectors. Engineers use them to evaluate plating bath compositions, additive packages, current densities, and temperature profiles before committing to full-scale production trials. The ability to simulate the flow dynamics of high-speed horizontal or vertical strip plating in a compact, transportable format reduces the cost and risk associated with process qualification.

    Technic also offers custom-built modular reel-to-reel equipment with interchangeable plating tools, positioned as a scalable extension of the laboratory development workflow. The flow cell therefore fits within a broader product development ecosystem, bridging laboratory chemistry work and production-scale equipment validation. For European electronics manufacturers engaged in lead frame plating, connector strip finishing, or advanced packaging substrate metallisation, the unit addresses the need for flexible, chemically compatible test infrastructure that can accommodate a range of electrolyte systems including gold, silver, tin, and palladium-based baths.

    Quelle: Technic (semicon) – https://www.technic.com/equipment/laboratory-and-rd/high-speed-reel-reel-test-cell

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