Indium Corporation Senior Area Technical Manager Leo Hu will present at FINE 2026, held 10–12 June in Shanghai, China. His session, titled 'Addressing Advanced Packaging Thermal Challenges: Innovations and Applications of Metal Thermal Interface Materials,' covers alloy composition optimisation, interface structure design, and precision processes as routes to improved thermal efficiency in advanced semiconductor packaging.
The presentation targets thermal management demands driven by AI accelerators and high-performance computing devices, where conventional TIM materials increasingly fall short. Indium Corporation positions metal-based TIMs as a solution to long-term reliability and heat dissipation requirements in next-generation electronics packaging.
Hu, based at Indium Corporation's Suzhou facility, brings 20 years of semiconductor packaging experience and serves on the China SMTA Technical Advisory Committee. The session is scheduled for 9:40 a.m. CST on 11 June.
Quelle: Indium Corporation – https://www.indium.com/press-releases/breaking-thermal-barriers-indium-corporation-to-present-metal-tims-solutions-for-next-generation-electronics-at-fine-2026/
