Micross Components, Inc., a US-based provider of high-reliability microelectronic products and services and a portfolio company of Behrman Capital, has announced a definitive agreement to acquire AEMtec GmbH, headquartered in Berlin, Germany. The announcement was made on 28 July 2026 via SEMICON Europa. AEMtec is currently a portfolio company of Capiton.
AEMtec specialises in complex micro- and optoelectronic module assembly, advanced packaging, and test services for high-reliability applications. The company operates cleanroom facilities in Berlin and Dresden, Germany, as well as in Boston, Massachusetts, USA. Its technology portfolio includes wafer back-end services, wafer testing, chip-on-board (CoB), flip chip assembly, 3D integration, and opto packaging — a breadth of competencies that directly complements Micross' existing service portfolio.
For the European electronics manufacturing market, the acquisition is notable. AEMtec has established itself as a single-source development and manufacturing partner for demanding customers in the semiconductor, medical and biotechnology, industrial automation, communications, and aerospace and defence sectors. Its end-to-end capability — spanning design, prototyping, industrialisation, qualification, series production and lifecycle support — positions the combined entity as a vertically integrated supplier for complex, mission-critical packaging requirements.
The deal represents a meaningful consolidation move in the European advanced packaging landscape. Advanced packaging, encompassing heterogeneous integration, 3D stacking and miniaturised optoelectronic assembly, is increasingly relevant as chiplet-based architectures and photonic integration gain traction across industrial and high-reliability markets. AEMtec's existing infrastructure and engineering expertise in these areas gives Micross an established European base from which to serve these growing segments without the lead time of greenfield expansion.
AEMtec's management team, led by CEO Robert Giertz, will join Micross following completion of the transaction. Financial terms of the agreement have not been disclosed. The acquisition is subject to customary regulatory approvals.
For European contract manufacturers and OEMs working in high-reliability segments, the transaction signals continued consolidation among specialised packaging service providers. Micross' broader global network — covering high-rel component sourcing, die processing, packaging and test — combined with AEMtec's European cleanroom capacity and optoelectronics know-how, creates a more comprehensive offering for customers requiring qualified, traceable packaging solutions under one roof.
Quelle: SEMICON Europa – https://www.semi.org/en/node/174011
