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    Startseite/Semiconductor-packaging/Artikel
    Delvitech Appoints Eric De Mey as CTO for Semiconductor Division
    Foto: Zulfugar Karimov / Unsplash
    Semiconductor-packaging

    Delvitech Appoints Eric De Mey as CTO for Semiconductor Division

    AI-driven inspection specialist expands into semiconductor and microelectronics sector with senior hire
    Veröffentlicht
    14. September 2026
    Lesezeit
    2 Minuten
    Rubrik
    Semiconductor-packaging

    Delvitech, the Swiss developer of AI-driven optical inspection systems, has appointed Eric De Mey as Chief Technology Officer of its newly established semiconductors division. The company describes the move as a strategic milestone in its technological expansion beyond conventional PCB-level inspection into the semiconductor and microelectronics sector.

    De Mey brings more than 35 years of experience spanning semiconductor design, IC development, RF technologies and international engineering management. His background positions him to guide Delvitech's application of artificial-intelligence-based inspection methodologies to the specific process control and defect-detection demands of semiconductor manufacturing environments.

    Delvitech is best known for its Horus platform, an AI-native automated optical inspection system developed for electronics manufacturing. The company has positioned machine-learning inference as a core differentiator, moving away from rule-based image comparison towards neural-network-driven defect classification. Extending this approach to semiconductor and microelectronics applications represents a logical but technically demanding step, given the tighter geometries, diverse substrate types and stricter quality requirements prevalent in that segment compared to standard SMT assembly inspection.

    The semiconductor inspection market is increasingly competitive, with established players offering wafer-level and advanced-packaging inspection tools. However, the proliferation of chiplet architectures, heterogeneous integration and advanced packaging formats — including flip-chip, fan-out wafer-level packaging and 2.5D/3D stacking — is creating demand for flexible, AI-assisted inspection solutions capable of handling novel defect modes that traditional rule-based systems struggle to classify reliably.

    For European electronics manufacturers operating at the intersection of SMT assembly and advanced semiconductor packaging — a growing segment driven by automotive, industrial and communications applications — Delvitech's expansion could be relevant. Contract manufacturers and EMS providers handling substrates, embedded components or chiplet-based modules may find AI-driven inspection tools that span both assembly and semiconductor-level process steps increasingly attractive from a workflow-integration perspective.

    Delvitech has not disclosed specific product roadmap details or timelines for semiconductor-focused inspection offerings under De Mey's leadership. Further technical and commercial details are expected as the division develops its go-to-market strategy.

    Quelle: Delvitech – https://delvi.tech/semiconductors-a-new-chapter-for-delvitech-and-a-new-horizon-for-ai-driven-inspection/

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